Crane Aerospace & Electronics Power Solutions
sMsa sꢀꢁglꢂ ꢃꢁꢄ dꢅꢃl dc/dc cꢆꢁvꢂꢇꢈꢂꢇꢉ
28 Voꢊt input – 5 Watt - pendinꢋ reVision F reꢊease
Class H and K, MIl-PRF-38534 ElEMEnt EvaluatIon
COmpOnent-level test
perfOrmed
space prototꢎpe (o)
cꢊass H
QMꢊ
cꢊass K
QMꢊ
1
non-QMꢊ
2
3
2
3
2
3
M/s
P
M/s
P
M/s
P
Element Electrical
Element Visual
yꢀꢂ
ꢆꢃ
ꢆꢃ
ꢆꢃ
yꢀꢂ
yꢀꢂ
yꢀꢂ
yꢀꢂ
yꢀꢂ
yꢀꢂ
yꢀꢂ
yꢀꢂ
Internal Visual
ꢆꢃ
ꢆꢃ
ꢆꢃ
ꢆꢃ
ꢆꢃ
ꢆꢃ
ꢆꢃ
n/a
ꢆꢃ
ꢆꢃ
ꢆꢃ
ꢆꢃ
ꢆꢃ
n/a
ꢆꢃ
yꢀꢂ
ꢆꢃ
n/a
ꢆꢃ
yꢀꢂ
yꢀꢂ
yꢀꢂ
yꢀꢂ
yꢀꢂ
yꢀꢂ
yꢀꢂ
n/a
n/a
yꢀꢂ
yꢀꢂ
yꢀꢂ
ꢆꢃ
n/a
yꢀꢂ
yꢀꢂ
n/a
n/a
n/a
n/a
yꢀꢂ
yꢀꢂ
yꢀꢂ
yꢀꢂ
n/a
yꢀꢂ
Temperature Cycling
Constant Acceleration
Interim Electrical
Burn-in
ꢆꢃ
ꢆꢃ
ꢆꢃ
n/a
n/a
n/a
n/a
ꢆꢃ
ꢆꢃ
n/a
n/a
n/a
n/a
ꢆꢃ
ꢆꢃ
Post Burn-in Electrical
Steady State Life
Voltage Conditioning Aging
Visual Inspection
Final Electrical
ꢆꢃ
ꢆꢃ
n/a
n/a
yꢀꢂ
yꢀꢂ
ꢆꢃ
ꢆꢃ
ꢆꢃ
ꢆꢃ
yꢀꢂ
yꢀꢂ
n/a
yꢀꢂ
4
Wire Bond Evaluation
ꢆꢃ
SEM
n/a
ꢆꢃ
SLAM™/C-SAM:
ꢆꢃ
Input capacitors only
(Add’l test, not req. by H or K)
Notes:
1. Non-QML products do not meet all of the requirements of MIL-PRF-38534.
2. M/S = Active components (Microcircuit and Semiconductor Die)
3. P = Passive components
4. Not applicable to EMI filters that have no wirebonds.
Definitions:
Element Evaluation: Component testing/screening per MIL-STD-883 as determined by MIL-PRF-38534
SEM: Scanning Electron Microscopy
SLAM™: Scanning Laser Acoustic Microscopy
C-SAM: C - Mode Scanning Acoustic Microscopy
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