C
ASES
Differently colored glass bead around pin one or dimple
in header (bottom or side of case) indicates pin one.
1.000 (25.40)
0.900 (22.86)
0.800 (20.32)
0.700 (17.78)
0.600 (15.24)
0.500 (12.70)
0.400 (10.16)
0.300 ( 7.62)
0.200 ( 5.08)
0.100 ( 2.54)
0.000
0.000
CASE D
TOP VIEW CASE D
MGA Series: Screening – Standard, ES, or 883
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
CASE D
TOP VIEW
See Figure 13
for pin
configurations.
1.110 max
(28.19)
(This view shows
straight leads.)
0.015
(0.38)
1.110 max
(28.19)
Cover marking is oriented with pin one
at the upper right corner.
Materials
Header
Kovar/Nickel/Gold
Cover
Kovar/Nickel
Pins
Kovar/Nickel/Gold,
matched glass seal
Case dimensions in inches (mm)
Tolerance
±0.005
(0.13) for three decimal places
±0.01
(0.3) for two decimal places
unless otherwise specified
CAUTION
Maximum reflow temperature is 220°C for a
maximum of 30 seconds. SN60, SN62, or SN63
are the recommended types of solder. See below
for Solder Mask instructions.
Hand soldering should not exceed 300°C for 10
seconds per pin.
Differently colored glass bead around pin one or dimple in
header (bottom or side of case) indicates pin one.
Cover marking is oriented with pin one at the upper right corner.
2.115 ref. (53.72)
0.50
(12.7)
0.08
(2.0)
Straight Leads
0.010
(0.25)
1.400 ref. (35.56)
0.135 ref.
(3.43)
1 0.010
(0.25)
Seam seal
0.250 max.
(6.35)
Gull Wing Leads
Option
1 Leads are solder dipped and lead
dimensions are prior to solder dip.
0.010 (0.25)
Bottom of lead to
bottom of case
0.055
(1.40)
F
IGURE
12: C
ASE
D
M
AXIMUM
D
IMENSIONS
F
IGURE
13: C
ASE
D
Solder Mask Notes
1. Pad dimensions are for the solder mask opening. Lead common to
each other can be connected underneath as desired.
2. Ground pins should be connected to the center pad for improved
grounding.
3. Center pad should not have a solder mask. Solder, copper, or Au/Ni
plate are preferred over solder for adhesive attach.
4. Solder coat to solder down converter.
5. If less rotation of case is desired, make the pad width 0.020inches
(0.51 mm). Pad length can be extended 0.010 inches (0.25 mm)
towards the case body and as-desired dimension away from the case
body.
6. Do not exceed 220°C as measured on the body of the converter (top
or bottom).
7. Attach the body of the case to the board with a thermally conductive
adhesive or SN60, 62, or 63 solder. The adhesive can be electrically
conductive as well. It can be applied as an underfill post solder or
dispensed and cured prior or during solder.
0.070
(1.78)
0.08
(2.0)
0.075 (1.91)
0.060 (1.52)
1.000 (25.40)
0.030 (0.76)
1.000
(25.40)
0.100 (2.54) 18X
0.100 (2.54) 4X
F
IGURE
14: C
ASE
D S
OLDER
M
ASK
Note: Although every effort has been made to render the case drawings at actual size, variations in the printing process may cause some distortion. Please refer
to the numerical dimensions for accuracy.
B8-9
CRANE [ Crane Aerospace & Electronics. ]
