IXD_609
5.4.3 Tape & Reel Information for SI and SIA Packages
∅1.55 0.05
330.2 DIA.
4.00 0.10 See Note #2
(13.00 DIA.)
0.30 0.05
R0.50 TYP
1.75 0.10
2.00 0.10
B
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
5.50 0.10
(3.40)
B0=5.20 0.10
12.00 0.30
A
A
Embossed Carrier
1.80 0.10
K0=2.30 0.10
∅1.50 (MIN)
B
8.00 0.10
SECTION B-B
A0=6.40 0.10
(1.20)
Embossment
(4.70)
(70º)
NOTES:
1. A0 & B0 measured at 0.3mm above base of pocket.
2. 10 pitches cumulative tol. 0.2mm
3. ( ) Reference dimensions only.
SECTION A-A
4. Unless otherwise specified, all dimensions in millimeters.
5.4.4 YI (5-Pin TO-263)
1.20 / 1.40
(0.047 / 0.055)
1.00 / 1.40
(0.039 / 0.055)
Recommended PCB Pattern
4.20 / 4.80
(0.165 / 0.189)
9.65 / 10.30
(0.380 / 0.406)
10.40
(0.409)
9.15
(0.360)
8.80 / 9.50
(0.346 / 0.374)
3.65
(0.144)
14.80 / 15.80
(0.583 / 0.622)
1
2 3 4 5
6.35
(0.250)
3.85
(0.152)
0.40 / 0.70
(0.016 / 0.028)
1.70 BSC
(0.067 BSC)
1.70
(0.067)
1.05
(0.041)
0.60 / 0.99
(0.024 / 0.039)
2.24 / 2.84
(0.088 / 0.112)
7.50 / 8.20
(0.295 / 0.323)
Optional
0º - 3º
6.60 / 7.20
(0.260 / 0.283)
DIMENSIONS
mm MIN / mm MAX
(inches MIN / inches / MAX)
2.10 / 2.70
(0.083 / 0.106)
6
NOTES:
1. All metal surfaces are solder-plated except trimmed area.
2. Short lead of No. 3 is optional to IXYS.
3. No. 3 lead is connected to No. 6 lead (bottom heat sink) internally.
1.20 / 1.70
(0.047 / 0.067)
12
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