IXD_609
5.4 Mechanical Dimensions
5.4.1 SIA (8-Pin SOIC)
0.10 / 0.25
(0.004 / 0.010)
1.27
(0.050)
0.40 / 1.27
(0.016 / 0.050)
3.80 / 4.00
(0.150 / 0.157)
5.40
(0.213)
5.80 / 6.20
(0.228 / 0.244)
1.55
(0.061)
PIN 1
0.25 / 0.50 x45º
(0.010 / 0.020 x45º)
0.60
0.31 / 0.51
(0.012 / 0.020)
1.27 BSC
(0.05 BSC)
(0.024)
0º / 8º
Recommended PCB Land Pattern
4.80 / 5.00
(0.190 / 0.197)
Dimensions
mm MIN / mm MAX
(inches MIN / inches MAX)
0.10 / 0.25
(0.004 / 0.010)
1.30 / 1.75
(0.051 / 0.069)
NOTE: Molded package conforms to JEDEC standard configuration
MS-012 variation AA.
5.4.2 SI (8-Pin Power SOIC with Exposed Metal Back)
3.80
(0.150)
0.10 / 0.25
(0.004 / 0.010)
1.55
(0.061)
0.40 / 1.27
(0.016 / 0.050)
3.80 / 4.00
(0.150 / 0.157)
5.40
(0.209) (0.108)
2.75
5.80 / 6.20
(0.228 / 0.244)
PIN 1
0.25 / 0.50 x45º
(0.010 / 0.020 x45º)
0.60
(0.024)
1.27
(0.050)
0.31 / 0.51
(0.012 / 0.020)
1.27 BSC
(0.05 BSC)
0º / 8º
4.80 / 5.00
(0.190 / 0.197)
Recommended PCB Land Pattern
0.03 / 0.10
(0.001 / 0.004)
1.30 / 1.75
(0.051 / 0.069)
Dimensions
mm MIN / mm MAX
(inches MIN / inches MAX)
NOTES:
2.29 / 2.79
1. Molded package conforms to JEDEC standard configuration
MS-012 variation BA.
(0.090 / 0.110)
2. The exposed metal pad on the back of the SI package should
be connected to GND. It is not suitable for carrying
current.
3.30 / 3.81
(0.130 / 0.150)
R02
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