1. Specifications
1.1 Package Pinout
1.2 Pin Description
SOIC
Pin
DFN
Pin
CPC1465D
Name
Description
PR+
NC
1
2
3
4
5
6
7
8
16 TC
1
2
3
4
1
2
PR+ Protection resistor positive side
NC No connection
15
14
13
12
11
10
9
NC
NC No connection
NC
NC
RS
3
4
5
6
TIP Tip lead
TIP
NC No connection
RING
NC No connection
PD
NC
5
6
RING Ring lead
NC
NC
NC No connection
NC
7
7
NC No connection
8
8
PR- Protection resistor negative side
COM Common
PR-
COM
9
9
10
11
12
13
14
15
16
10
11
12
13
14
15
16
NC No connection
CPC1465M
NC No connection
PR+
NC
TIP
NC
NC
1
2
3
4
5
6
7
8
PD Photo-diode (LED input current)
RS Current limiting resistor
NC No connection
16 TC
15
14
13
12
11
10
9
NC
NC
RS
NC No connection
TC Timing capacitor
PD
NC
1.3 Absolute Maximum Ratings
RING
NC
Parameter
Minimum Maximum Unit
NC
Maximum Voltage (T to R,
R to T)*
-
300
V
PR-
COM
Power dissipation
-
1
W
°C
%
Operating temperature
Operating relative humidity
Storage temperature
-40
5
+85
95
-40
+125
°C
*Clare recommends the use of room-temperature-vulcanizing silicone RTV
sealant on the SOIC package tip and ring pins (pins 4 and 5) to guard
against the possibility of arcing.
Electrical absolute maximum ratings are at 25°C.
Absolute maximum ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
R02
www.clare.com
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