CS5361
DC ELECTRICAL CHARACTERISTICS
GND = 0 V, all voltages with respect to ground. MCLK=12.288 MHz; Master Mode.
Parameter
Symbol
Min
Typ
Max
Unit
Power Supply Current
(Normal Operation)
VA = 5 V
VL,VD = 5 V
VL,VD = 3.3 V
I
I
I
-
-
-
17.5
22
14.5
21.5
27.5
17
mA
mA
mA
A
D
D
Power Supply Current
(Power-Down Mode) (Note 8)
VA = 5 V
VL,VD = 5 V
I
I
-
-
100
100
-
-
µA
µA
A
D
Power Consumption
(Normal Operation)
VA, VD, VL = 5 V
VA = 5 V, VL, VD = 3.3 V
(Power-Down Mode)
-
-
-
-
-
-
198
135
1
243
161
-
mW
mW
mW
Power Supply Rejection Ratio (1 kHz)
(Note 9)
PSRR
-
65
-
dB
V Nominal Voltage
Output Impedance
Maximum allowable DC current source/sink
-
-
-
2.5
25
0.01
-
-
-
V
kΩ
mA
Q
Filt+ Nominal Voltage
Output Impedance
Maximum allowable DC current source/sink
-
-
-
5
15
0.01
-
-
-
V
kΩ
mA
Notes: 8. Power Down Mode is defined as RST = Low with all clocks and data lines held static.
9. Valid with the recommended capacitor values on FILT+ and VQ as shown in the Typical Connection
Diagram.
DIGITAL CHARACTERISTICS
Parameter
Symbol
Min
70%
-
Typ
Max
Units
High-Level Input Voltage
Low-Level Input Voltage
(% of VL)
(% of VL)
(% of VL)
V
-
-
-
-
30%
-
V
V
V
IH
V
IL
High-Level Output Voltage at I = 100 µA
V
70%
o
OH
Low-Level Output Voltage at I = 100 µA
(% of VL)
V
-
-
-
-
15%
4.0
V
o
OL
I
mA
ovfl
OVFL Current Sink
Input Leakage Current (all pins except SCLK and LRCK)
Input Leakage Current (SCLK and LRCK)
I
-10
-25
-
-
10
25
µA
µA
in
I
in
THERMAL CHARACTERISTICS
Parameter
Symbol
Min
Typ
Max
Unit
Allowable Junction Temperature
-
-
135
°C
Junction to Ambient Thermal Impedance
(Multi-layer PCB) TSSOP
°C/W
°C/W
°C/W
°C/W
-
-
-
-
70
60
105
80
-
-
-
-
θJA-TM
θJA-SM
θJA-TS
θJA-SS
(Multi-layer PCB) SOIC
(Single-layer PCB) TSSOP
(Single-layer PCB) SOIC
10
DS467F2
CIRRUS [ CIRRUS LOGIC ]
