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CS5156GDR16 参数 Datasheet PDF下载

CS5156GDR16图片预览
型号: CS5156GDR16
PDF下载: 下载PDF文件 查看货源
内容描述: CPU 5位非同步降压控制器 [CPU 5-Bit Nonsynchronous Buck Controller]
分类和应用: 控制器
文件页数/大小: 14 页 / 310 K
品牌: CHERRY [ CHERRY SEMICONDUCTOR CORPORATION ]
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Applications Information: continued  
where:  
1
Period =  
switching frequency  
“Droop” Resistor for Adaptive Voltage Positioning  
Adaptive voltage positioning is used to reduce output volt-  
age excursions during abrupt changes in load current.  
Regulator output voltage is offset +40mV when the regula-  
tor is unloaded, and -40mV at full load. This results in  
increased margin before encountering minimum and maxi-  
mum transient voltage limits, allowing use of less capaci-  
tance on the regulator output (see Figure 7).  
To implement adaptive voltage positioning, a “droop”  
resistor must be connected between the output inductor  
and output capacitors and load. This is normally imple-  
mented by a PC board trace of the following value:  
Channel 3 = V  
M1= V  
Channel 2 = Inductor Switching Node  
GATE  
- 5V  
GATE  
IN  
80mV  
RDROOP  
=
IMAX  
Figure 15: CS5156 gate drive waveforms depicting rail to rail swing.  
Adaptive voltage positioning can be disabled for improved  
DC regulation by connecting the VFB pin directly to the load  
using a separate, non-load current carrying circuit trace.  
The most important aspect of MOSFET performance is  
RDSON, which effects regulator efficiency and MOSFET  
thermal management requirements.  
Input and Output Capacitors  
The power dissipated by the MOSFETs and the Schottky  
These components must be selected and placed carefully to  
yield optimal results. Capacitors should be chosen to pro-  
vide acceptable ripple on the input supply lines and regula-  
tor output voltage. Key specifications for input capacitors  
are their ripple rating, while ESR is important for output  
capacitors. For best transient response, a combination of  
low value/high frequency and bulk capacitors placed close  
to the load will be required.  
diode may be estimated as follows;  
Switching MOSFET:  
Power = ILOAD2 × RDSON × duty cycle  
Schottky diode:  
Power = VFORWARD × ILOAD × (1 - duty cycle)  
VOUT + VFORWARD  
Duty Cycle =  
Output Inductor  
VIN + VFORWARD - (ILOAD × RDSON OF SWITCH FET  
)
The inductor should be selected based on its inductance,  
current capability, and DC resistance. Increasing the induc-  
tor value will decrease output voltage ripple, but degrade  
transient response.  
Off Time Capacitor (COFF  
The COFF timing capacitor sets the regulator off time:  
)
TOFF = COFF × 4848.5  
Thermal Management  
When the VFFB pin is less than 1V, the current charging the  
C
OFF capacitor is reduced. The extended off time can be cal-  
Thermal Considerations for Power MOSFETs and Diodes  
culated as follows:  
TOFF = COFF × 24,242.5.  
In order to maintain good reliability, the junction tempera-  
ture of the semiconductor components should be kept to a  
maximum of 150°C or lower. The thermal impedance (junc-  
tion to ambient) required to meet this requirement can be  
calculated as follows:  
Off time will be determined by either the TOFF time, or the  
time out timer, whichever is longer.  
The preceding equations for duty cycle can also be used to  
calculate the regulator switching frequency and select the  
COFF timing capacitor:  
T
JUNCTION(MAX) - TAMBIENT  
Power  
Thermal Impedance =  
Period × (1 - duty cycle)  
A heatsink may be added to TO-220 components to reduce  
their thermal impedance. A number of PC board layout  
techniques such as thermal vias and additional copper foil  
COFF  
=
,
4848.5  
11