CS51033
Package Specification
PACKAGE DIMENSIONS IN mm (INCHES)
PACKAGE THERMAL DATA
D
Lead Count
8L SO Narrow
8L PDIP
Metric
Max
Min
5.00
4.80
10.16
9.02
English
Max Min
.197 .189
.400 .355
Thermal Data
R
ΘJC
typ
R
ΘJA
typ
8L SO Narrow
45
165
8L PDIP
52
100
˚C/W
˚C/W
Surface Mount Narrow Body (D); 150 mil wide
4.00 (.157)
3.80 (.150)
6.20 (.244)
5.80 (.228)
0.51 (.020)
0.33 (.013)
1.27 (.050) BSC
1.75 (.069) MAX
1.57 (.062)
1.37 (.054)
1.27 (.050)
0.40 (.016)
0.25 (.010)
0.19 (.008)
D
REF: JEDEC MS-012
0.25 (0.10)
0.10 (.004)
Plastic DIP (N); 300 mil wide
7.11 (.280)
6.10 (.240)
8.26 (.325)
7.62 (.300)
3.68 (.145)
2.92 (.115)
1.77 (.070)
1.14 (.045)
2.54 (.100) BSC
.356 (.014)
.203 (.008)
0.39 (.015)
MIN.
.558 (.022)
.356 (.014)
Some 8 and 16 lead
packages may have
1/2 lead at the end
of the package.
All specs are the same.
REF: JEDEC MS-001
D
Ordering Information
Part Number
CS51033YD8
CS51033YDR8
CS51033YN8
Rev. 2/13/98
Description
8L SO Narrow
8L SO Narrow
(tape & reel)
8L PDIP
8
Cherry Semiconductor Corporation reserves the right to
make changes to the specifications without notice. Please
contact Cherry Semiconductor Corporation for the latest
available information.
© 1999 Cherry Semiconductor Corporation