RATING CHARACTERISTIC CURVES ( 2N7002DSPT )
Typical Thermal Characteristics
1.2
1.1
1
0.55
0.5
1a
1a
1b
0.9
0.8
0.7
0.6
0.45
0.4
1b
1c
1c
4.5"x5" FR-4 Board
TA
25 o
Still Air
VGS 10V
0.1
4.5"x5" FR-4 Board
TA
25o
Still Air
=
C
=
C
=
0.35
0
0.2
0.4
0.6
0.8
1
0
0.025
0.05
0.075
0.125
2
2
2oz COPPER MOUNTING PAD AREA (in
)
2oz COPPER MOUNTING PAD AREA (in
)
Figure 12. SOT-6 Dual Package Maximum
Figure 13. Maximum Steady-State Drain
Current versus Copper Mounting Pad
Area.
Steady-State Power Dissipation versus Copper
Mounting Pad Area.
3
2
1
0.5
0.2
0.1
VGS = 10V
SINGLE PULSE
0.05
R
JA = See Note 1c
TA = 25°C
θ
0.02
0.01
1
2
5
10
20
50
70
V
, DRAIN-SOURCE VOLTAGE (V)
DS
Figure 14. Maximum Safe Operating Area.
1
D
= 0.5
0.5
R
(t)
=
r(t)
* R
JA
JA
θ
θ
R
= See Note 1c
0.2
JA
θ
0.2
0.1
0.1
P(pk)
0.05
t
1
0.05
t
2
0.02
0.01
T
-
T
=
P
*
R
=
(t)
JA
J
A
θ
t
Single Pulse
0.02
0.01
Duty Cycle,
D
/
t
2
1
0.0001
0.001
0.01
0.1
, TIME (sec)
1
10
100
300
t
1
Figure 15. Transient Thermal Response Curve.
Note: Thermal characterization performed using the conditions described in note 1c. Transient thermal response will change
depending on the circuit board design.
NDC7002N.SAM
CHENMKO [ CHENMKO ENTERPRISE CO. LTD. ]
