RATING CHARACTERISTIC CURVES ( 2N7002DSPT )
Typical Thermal Characteristics
1.2
STEADY-STATE POWER DISSIPATION (W)
I
D
, STEADY-STATE DRAIN CURRENT (A)
0.55
1.1
1a
0.5
1
1a
1b
0.9
1b
0.45
1c
0.8
1c
0.4
4.5"x5" FR-4 Board
T
A
= 2 5 C
Still Air
V
G S
= 1 0 V
o
0.7
4.5"x5" FR-4 Board
T
A
= 2 5 C
Still Air
o
0.6
0
0.2
0.4
0.6
0.8
2oz COPPER MOUNTING PAD AREA (in
2
)
1
0.35
0
0.025
0.05
0.075
0.1
2
2oz COPPER MOUNTING PAD AREA (in )
0.125
Figure 12. SOT-6 Dual Package Maximum
Steady-State Power Dissipation versus Copper
Mounting Pad Area.
3
2
1
I
D
, DRAIN CURRENT (A)
0.5
S
RD
(O
N)
LIM
IT
Figure 13. Maximum Steady-State Drain
Current versus Copper Mounting Pad
Area.
10
0
1m us
s
10
ms
0.2
0.1
10
0m
s
V
0.05
GS
= 10V
1s
SINGLE PULSE
R
θ
J A
= See Note 1c
T
A
= 25°C
1
2
DC
0.02
0.01
5
10
20
V
DS
, DRAIN-SOURCE VOLTAGE (V)
50
70
Figure 14. Maximum Safe Operating Area.
1
r(t), NORMALIZED EFFECTIVE
TRANSIENT THERMAL RESISTANCE
0 .5
D = 0.5
0 .2
0 .1
0.05
0.2
0.1
P(pk)
0.05
0.02
0.01
R
JA
(t) = r(t) * R
JA
θ
θ
R
JA
= See Note 1c
θ
t
1
T
J
- T
t
2
0.02
0.01
0 .0 0 0 1
Single Pulse
= P * R
JA
(t)
A
θ
Duty Cycle, D = t
1
/ t
2
0 .0 1
0 .1
t
1
, TIME (sec)
1
10
100
300
0 .001
Figure 15. Transient Thermal Response Curve
.
Note:
Thermal characterization performed using the conditions described in note 1c. Transient thermal response will change
depending on the circuit board design.
NDC7002N.SAM
CHENMKO [ CHENMKO ENTERPRISE CO. LTD. ]
