CALIFORNIA MICRO DEVICES
CSPPT
PRINTED CIRCUIT BOARD RECOMMENDATIONS
Pad Size on PCB
0.300mm
Pad Shape
Round
Pad Definition
Non Solder Mask Defined Pads (NSMD)
Solder Mask Opening
Solder Stencil Thickness
Solder Stencil Aperture Opening
Solder Flux Ratio
Solder Paste
0.350mm
0.152mm
0.360mm (sq.)
50/50
No Clean
Bond Trace Finish
OSP (Entek Cu Plus 106A)
Typical Solder Reflow Thermal Profile (No Clean Flux)
250
EXH
PH
Z2
Z3
Z4
Z5
RF
CD
EXH
225
200
175
150
125
100
75
50
25
0
48
97
145
194
Time (s)
242
290
339
387
435
PART NUMBER KEY
CSP PT YY XXX
T
Resistor
Number of
Value Code
Terminations
PACKAGE TYPE
APPLICATION
Tolerance
CSP = Chip Scale
Package
Parallel Termination
08 = 8
16 = 16
32 = 32
R1 Value
F = 1ꢀ
J = 5ꢀ
First 2 digits
are significant
value. 3rd digit
represents number
of zeros
© 2000 California Micro Devices Corp. All rights reserved.
11/10/2000 215 Topaz Street, Milpitas, California 95035
Tel: (408) 263-3214
Fax: (408) 263-7846
www.calmicro.com
3
CALMIRCO [ CALIFORNIA MICRO DEVICES CORP ]
