CM3106
Performance Information (cont’d)
Typical Thermal Characteristics (cont’d) (nominal conditions unless otherwise specified)
The theoretical calculations of these relationships
show the safe operating area of the CM3106 in the
SOIC package.
Thermal characteristics were measured using a double
sided board with two square inches of copper area
connected to the GND pins for "heat spreading".
Measurements showing performance up to a junction
temperature of 150°C were performed under light load
conditions (5mA). This allows the ambient temperature
to be representative of the internal junction tempera-
ture.
Note: The use of multi-layer board construction with
separate ground and power planes will further enhance
the overall thermal performance.
Figure 12. Reference Voltage vs. Temperature
Figure 13. V
TT
Output Voltage vs.Temperature
(5mA load)
Figure 14. AV
IN
Quiescent Current vs.Temperature
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02/02/04
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