CM3106
Mechanical Details
The CM3106 is available in an 8-lead SOIC and PSOP
package.
Mechanical Package Diagrams
SOIC-8 Mechanical Specifications
TOP VIEW
Dimensions for CM3106 devices packaged in 8-pin
SOIC packages are presented below.
D
8
7
6
5
For complete information on the SOIC-8 package, see
the California Micro Devices SOIC Package Informa-
tion document.
E
H
Pin 1
Marking
PACKAGE DIMENSIONS
Package
Leads
SOIC
8
1
2
3
4
Millimeters
Inches
Dimensions
SIDE VIEW
Min
Max
1.75
0.25
Min
Max
0.069
0.010
A
1.35
0.10
0.053
0.004
A
A
1
SEATING
PLANE
A1
B
0.33
0.19
4.80
3.80
0.51
0.25
5.00
4.19
0.013
0.007
0.189
0.150
0.020
0.010
0.197
0.165
B
e
C
D
E
END VIEW
e
1.27 BSC
0.050 BSC
H
L
5.80
0.40
6.20
1.27
0.228
0.016
0.244
0.050
C
# per tube
100 pieces*
2500 pieces
L
# per tape
and reel
Controlling dimension: inches
Package Dimensions for SOIC-8
* This is an approximate number which may vary.
© 2004 California Micro Devices Corp. All rights reserved.
10
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
L
Tel: 408.263.3214 L Fax: 408.263.7846 L www.calmicro.com 02/02/04
CALMIRCO [ CALIFORNIA MICRO DEVICES CORP ]
