PRELIMINARY
CM1470
Application Information
Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages
offered by California Micro Devices.
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER
VALUE
0.240mm
Pad Size on PCB
Pad Shape
Round
Pad Definition
Non-Solder Mask defined pads
0.290mm Round
0.125 - 0.150mm
0.300mm Round
50/50 by volume
No Clean
Solder Mask Opening
Solder Stencil Thickness
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
Solder Flux Ratio
Solder Paste Type
Pad Protective Finish
OSP (Entek Cu Plus 106A)
+50μm
Tolerance — Edge To Corner Ball
Solder Ball Side Coplanarity
+20μm
Maximum Dwell Time Above Liquidous
Maximum Soldering Temperature for Eutectic Devices using a Eutectic Solder Paste
Maximum Soldering Temperature for Lead-free Devices using a Lead-free Solder Paste
60 seconds
240°C
260°C
Non-Solder Mask Defined Pad
0.240mm DIA.
Solder Stencil Opening
0.300mm DIA.
Solder Mask Opening
0.290mm DIA.
Figure 4. Recommended Non-Solder Mask Defined Pad Illustration
250
200
150
100
50
0
1:00.0
2:00.0
3:00.0
4:00.0
Time (minutes)
Figure 5. Eutectic (SnPb) Solder
Ball Reflow Profile
Figure 6. Lead-free (SnAgCu) Solder
Ball Reflow Profile
© 2006 California Micro Devices Corp. All rights reserved.
03/15/06
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
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Fax: 408.263.7846
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www.cmd.com
7
CALMIRCO [ CALIFORNIA MICRO DEVICES CORP ]
