PRELIMINARY
CM1470
Mechanical Details
CM1470-08CP Mechanical Specifications
Mechanical Package Diagrams
Dimensions for the CM1470-08CP supplied in an 18-
bump, 0.4mm pitch chip scale package (CSP) are pre-
sented below.
OptiGuardTM Coated CSP
For complete information on the CSP-18, see the Cali-
fornia Micro Devices CSP Package Information docu-
ment.
BOTTOM VIEW
OptiGuardTM
Coating
A1
C1
B1
PACKAGE DIMENSIONS
9
Package
Bumps
Custom CSP
18
8
7
6
Millimeters
Nom Max
Inches
Nom
Dim
A
A
B
B
Min
Min
Max
5
4
3
2
1
A1
A2
B1
B2
C1
C2
D1
D2
0.791 0.836 0.881 0.0311 0.0329 0.0347
3.585 3.630 3.675 0.1411 0.1429 0.1447
0.395 0.400 0.405 0.0156 0.0157 0.0159
0.395 0.400 0.405 0.0156 0.0157 0.0159
0.168 0.218 0.268 0.0066 0.0086 0.0106
0.165 0.215 0.265 0.0065 0.0085 0.0104
0.537 0.607 0.676 0.0211 0.0239 0.0266
0.368 0.419 0.470 0.0145 0.0165 0.0185
B
A
D1
D2
0.25 DIA.
# per tape and
reel
3500 pieces
63/37 Sn/Pb (Eutectic) or
96.8/2.6/0.6 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
SIDE
VIEW
Controlling dimension: millimeters
NOTE: DIMENSIONS IN MILLIMETERS
Package Dimensions for
CM1470-08CP Chip Scale Package
© 2006 California Micro Devices Corp. All rights reserved.
10
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com 03/15/06
CALMIRCO [ CALIFORNIA MICRO DEVICES CORP ]
