CM1460
Mechanical Details (cont’d)
TDFN-16 Mechanical Specifications
The CM1460-08DE is supplied in an 16-lead, 0.5mm
pitch TDFN package. Dimensions are presented
below.
For complete information on the TDFN-16, see the Cal-
ifornia Micro Devices TDFN Package Information doc-
ument.
E
Mechanical Package Diagrams
D
16 15 14 13 12 11 10 9
Pin 1
Marking
PACKAGE DIMENSIONS
Package
JEDEC
No.
Leads
Dim.
A
A1
A3
b
D
D2
E
E2
e
K
L
# per
tape and
reel
0.20
0.20
0.30
0.40
3.90
3.10
1.50
0.30
Millimeters
Min
0.70
0.00
0.40
Nom
0.75
0.02
0.55
0.20 REF
4.00
3.20
1.60
0.40
0.50 BSC
0.008
0.008
0.010
0.012
3000 pieces
4.10
3.30
1.70
0.50
Max
0.80
0.05
0.70
Min
0.028
0.000
0.016
0.153
0.122
0.059
0.012
TDFN
MO-229C
✝
16
Inches
Nom
0.030
0.001
0.022
0.157
0.126
0.063
0.016
BSC
K
0.10 C
1 2 3 4 5 6 7 8
TOP VIEW
Max
0.031
0.002
0.028
0.161
0.130
0.067
0.020
Pin 1
Locator
e
0.08 C
A1
SIDE VIEW
A
A3
0.008 REF
8X
0.10
M
CAB
b
1
2
3
C0.2
4
5
6
7
8
E2
GND PAD
9
16 15 14 13 12 11 10
D2
L
BOTTOM VIEW
Controlling dimension: millimeters
✝
This package is compliant with JEDEC standard MO-229C with the
exception of the "D", "D2", "E", "E2", "K" and "L" dimensions as
called out in the table above.
Dimensions for 16-Lead, 0.5mm pitch
TDFN package
© 2006 California Micro Devices Corp. All rights reserved.
02/23/06
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com
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