CM1460
Mechanical Details
TDFN-08 Mechanical Specifications
The CM1460-04DE is supplied in an 8-lead, 0.5mm
pitch TDFN package. Dimensions are presented
below.
For complete information on the TDFN-08, see the Cal-
ifornia Micro Devices TDFN Package Information doc-
ument.
Mechanical Package Diagrams
D
8 7 6 5
PACKAGE DIMENSIONS
Package
JEDEC
No.
Leads
Dim.
A
A1
A2
A3
b
D
D2
E
E2
e
K
L
L2
R
r1
# per
tube
# per
tape and
reel
0.075
0.075
NA
3000 pieces
K
e
TDFN
MO-229 (Var. VCCD-3)
✝
8
Millimeters
Min
0.70
0.00
0.55
0.20
1.50
0.80
0.20
0.20
0.30
0.40
0.13
0.003
0.003
Nom
0.75
0.02
0.65
0.20
0.25
2.00
1.60
2.00
0.90
0.50
0.008
0.008
0.012
0.016
0.005
1.00
0.031
1.70
0.059
0.30
0.008
Max
0.80
0.05
0.80
Min
0.028
0.000
0.022
Inches
Nom
0.030
0.001
0.026
0.008
0.010
0.079
0.063
0.079
0.035
0.020
0.039
0.067
0.012
Max
0.031
0.002
0.031
E
Pin 1
Marking
1 2 3 4
TOP VIEW
0.10 C
0.08 C
A1
SIDE VIEW
A
A3 A2
1 2 3 4
D2
r1
GND PAD
E2
C0.25
R
L
8 7 6 5
b
8X
Controlling dimension: millimeters
✝
BOTTOM VIEW
0.10
M
CAB
This package is compliant with JEDEC standard MO-229, variation
VCCD-3 with exception of the "D2" and "E2" dimensions as called
out in the table above and the "r1" dimension which is not specified
in the MO-229 standard.
Package Dimensions for 8-Lead, 0.5mm pitch
TDFN Package
© 2006 California Micro Devices Corp. All rights reserved.
02/23/06
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com
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