PRELIMINARY
CM1450
Mechanical Details
CM1450 devices are supplied in custom Chip Scale
Packages (CSP). Dimensions for each of these
devices are presented in the following pages.
CM1450-06CS/CP Mechanical Specifications
The package dimensions for the CM1450-06CS/CP
are presented below.
C1
Mechanical Package Diagrams
BOTTOM VIEW
A1
B1
C
B2
B4
B3
SIDE
VIEW
PACKAGE DIMENSIONS
Package
Bumps
Dim
A1
A2
B1
B2
B3
B4
C1
C2
D1
D2
Millimeters
Min
Nom
Max
Min
Custom CSP
15
Inches
Nom
Max
B
A
1
2
3
4
5
6
A2
C2
D1
D2
2.915 2.960 3.005 0.1148 0.1165 0.1183
1.285 1.330 1.375 0.0506 0.0524 0.0541
0.495 0.500 0.505 0.0195 0.0197 0.0199
0.245 0.250 0.255 0.0096 0.0098 0.0100
0.430 0.435 0.440 0.0169 0.0171 0.0173
0.430 0.435 0.440 0.0169 0.0171 0.0173
0.180 0.230 0.280 0.0071 0.0091 0.0110
0.180 0.230 0.280 0.0071 0.0091 0.0110
0.561 0.605 0.649 0.0221 0.0238 0.0255
0.355 0.380 0.405 0.0140 0.0150 0.0159
3500 pieces
0.30 DIA.
63/37 Sn/Pb (Eutectic) or
96.8/2.6/0.6 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
DIMENSIONS IN MILLIMETERS
Package Dimensions for
CM1450-06CS/CP Chip Scale Package
# per tape and
reel
Controlling dimension: millimeters
©
2005 California Micro Devices Corp. All rights reserved.
6
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.calmicro.com
01/27/05
CALMIRCO [ CALIFORNIA MICRO DEVICES CORP ]
