CM1233
PACKAGE / PINOUT DIAGRAMS
Bottom View (Solder Side)
Out_1+
Out_1-
Out_2+
Out_2-
Out_3+
Out_3-
Out_4+
Out_4-
In_1+
In_1-
In_2+
In_2-
In_3+
In_3-
In_4+
In_4-
Note:
1) This drawing is not to scale.
PIN DESCRIPTIONS
Pin
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
PAD
Name
In_1+
In_1-
In_2+
In_2-
In_3+
In_3-
In_4+
In_4-
Out_4-
Out_4+
Out_3-
Out_3+
Out_2-
Out_2+
Out_1-
Out_1+
GND
Description
Bidrectional Clamp to ASIC (inside system)
Bidrectional Clamp to ASIC (inside system)
Bidrectional Clamp to ASIC (inside system)
Bidrectional Clamp to ASIC (inside system)
Bidrectional Clamp to ASIC (inside system)
Bidrectional Clamp to ASIC (inside system)
Bidrectional Clamp to ASIC (inside system)
Bidrectional Clamp to ASIC (inside system)
Bidrectional Clamp to Connector (outside system)
Bidrectional Clamp to Connector (outside system)
Bidrectional Clamp to Connector (outside system)
Bidrectional Clamp to Connector (outside system)
Bidrectional Clamp to Connector (outside system)
Bidrectional Clamp to Connector (outside system)
Bidrectional Clamp to Connector (outside system)
Bidrectional Clamp to Connector (outside system)
Ground return to shield
Ordering Information
PART NUMBERING INFORMATION
PIN
16
PACKAGE
TDFN-16
ORDERING PART NUMBER
(LEAD-FREE FINISH)
CM1233
-08DE
PART MARKING
CM1233-08
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.
© 2008 California Micro Devices Corp. All rights reserved.
4
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
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Tel: 408.263.3214
Issue A – 03/18/08
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Fax: 408.263.7846
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