CM1205
Mechanical Details
The CM1205 devices are packaged in custom Chip
Scale Packages (CSP).
CM1205-04CS/CP 6-bump CSP Mechanical Specifications
The CM1205-04CS/CP devices are packaged in a 6-
bump custom Chip Scale Package (CSP). Dimensions
are presented below.
Mechanical Package Diagrams
BOTTOM VIEW
A1
C1
B1
3
B3
B2
PACKAGE DIMENSIONS
Package
Bumps
Dim
A1
A2
B1
B2
B3
C1
C2
D1
D2
Millimeters
Min
1.109
1.759
0.645
0.645
0.645
0.202
0.202
0.638
0.394
Nom
1.154
1.804
0.650
0.650
0.650
0.252
0.252
0.707
0.445
Max
1.199
1.849
0.655
0.655
0.655
0.302
0.302
0.776
0.495
Min
Custom CSP
6
Inches
Nom
Max
0.0437 0.0454 0.0472
0.0693 0.0710 0.0728
0.0254 0.0256 0.0258
0.0254 0.0256 0.0258
0.0254 0.0256 0.0258
0.0080 0.0099 0.0119
0.0080 0.0099 0.0119
0.0251 0.0278 0.0306
0.0155 0.0175 0.0195
3500 pieces
OptiGuard
TM
Coating
A2
2
1
B
A
C2
D1
D2
0.35 DIA.
63/37 Sn/Pb (Eutectic) or
96.8/2.6/0.6 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
SIDE
VIEW
NOTE: DIMENSIONS IN MILLIMETERS
# per tape and
reel
Package Dimensions for CM1205-04CS/CP
6-bump Chip Scale Package
Controlling dimension: millimeters
CSP Tape and Reel Specifications
POCKET SIZE (mm)
B
0
X A
0
X K
0
1.98 X 1.32 X 0.91
TAPE WIDTH
W
8mm
REEL
DIA.
178mm (7")
QTY
PER
REEL
3500
PART NUMBER
CM1205-04CS/CP
CHIP SIZE (mm)
1.804 X 1.154 X
0.644
P
0
4mm
P
1
4mm
P
o
Top
Cover
Tape
10 Pitches Cumulative
Tolerance On Tape
±
0.2 mm
A
o
W
K
o
B
o
For tape feeder reference
only including draft.
Concentric around B.
Embossment
P
1
User Direction of Feed
Center Lines
of Cavity
Figure 4. Tape and Reel Mechanical Data
© 2003 California Micro Devices Corp. All rights reserved.
11/17/03
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
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Tel: 408.263.3214
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Fax: 408.263.7846
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www.calmicro.com
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