CM1205
Application Information
Refer to Application Note AP-217, "The Chip Scale
Package", for a detailed description of Chip Scale
Packages offered by California Micro Devices.
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER
Pad Size on PCB
Pad Shape
Pad Definition
Solder Mask Opening
Solder Stencil Thickness
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
Solder Flux Ratio
Solder Paste Type
Pad Protective Finish
Tolerance — Edge To Corner Ball
Solder Ball Side Coplanarity
Maximum Dwell Time Above Liquidous
Soldering Maximum Temperature
VALUE
0.300mm
Round
Non-Solder Mask defined pads
0.350mm Round
0.125 - 0.150mm
0.360mm Round
50/50 by volume
No Clean
OSP (Entek Cu Plus 106A)
+50µm
+20µm
60 seconds
260°C
Non-Solder Mask Defined Pad
0.300mm DIA.
Solder Stencil Opening
0.360mm DIA.
Solder Mask Opening
0.350mm DIA.
Figure 1. Recommended Non-Solder Mask Defined Pad Illustration
250
Temperature (°C)
200
150
100
50
0
1:00.0
2:00.0
3:00.0
Time (minutes)
4:00.0
Figure 2. Eutectic (SnPb) Solder
Ball Reflow Profile
© 2003 California Micro Devices Corp. All rights reserved.
Figure 3. Lead-free (SnAgCu) Solder
Ball Reflow Profile
4
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
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Tel: 408.263.3214
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Fax: 408.263.7846
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www.calmicro.com
11/17/03
CALMIRCO [ CALIFORNIA MICRO DEVICES CORP ]
