Data Sheet
Layout Considerations
General layout and supply bypassing play major roles in
high frequency performance. CADEKA has evaluation
boards to use as a guide for high frequency layout and as
an aid in device testing and characterization. Follow the
steps below as a basis for high frequency layout:
• Include 6.8µF and 0.1µF ceramic capacitors for power
supply decoupling
• Place the 6.8µF capacitor within 0.75 inches of the power pin
• Place the 0.1µF capacitor within 0.1 inches of the power pin
• Remove the ground plane under and around the part,
especially near the input and output pins to reduce para-
sitic capacitance
• Minimize all trace lengths to reduce series inductances
Refer to the evaluation board layouts below for more in-
formation.
Figure 7. CEB006 Schematic
Evaluation Board Information
The following evaluation boards are available to aid in the
testing and layout of these devices:
Evaluation Board #
CEB006
CEB018
Products
LM358
LM324
Evaluation Board Schematics
Evaluation board schematics and layouts are shown in Fig-
ures 7-12. These evaluation boards are built for dual- sup-
ply operation. Follow these steps to use the board in a
single-supply application:
Figure 8. CEB006 Top View
1. Short -Vs to ground.
2. Use C3 and C4, if the -V pin of the amplifier is not
S
directly connected to the ground plane.
Figure 9. CEB006 Bottom View
©2011 CADEKA Microcircuits LLC
www.cadeka.com
12
CADEKA [ CADEKA MICROCIRCUITS LLC. ]
