Data Sheet
Mechanical Dimensions
SOIC-8 Package
SOIC-8
D
e
C
L
X
θ
2
SYMBOL
A
A1
B
D
E
H
e
C
L
X
θ
1
θ
2
MIN
MAX
0.054
0.068
0.004
0.0098
0.014
0.019
0.189
0.196
0.150
0.157
0.229
0.244
0.050 BSC
0.0075
0.0098
0.016
0.034
0.0215 Ref
0°
8°
7° BSC
Comlinear CLC2005
Dual, Low Cost, +2.7V to 5.5V, 260MHz Rail-to-Rail Amplifier
C
L
E
H
Gauge Plane
Seating Plane
®
Pin No. 1
B
DETAIL-A
L
0.015±0.004 x 45°
A1
DETAIL-A
NOTE:
1.
2.
3.
4.
5.
All dimensions are in inches.
Lead coplanarity should be 0" to 0.004" max.
Package surface finishing: VDI 24~27
All dimension excluding mold flashes.
The lead width, B to be determined at 0.0075"
from the lead tip.
A
θ
1
C
Rev 1B
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