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BL-B3141-TBS18C 参数 Datasheet PDF下载

BL-B3141-TBS18C图片预览
型号: BL-B3141-TBS18C
PDF下载: 下载PDF文件 查看货源
内容描述: 芯片材料:砷化镓/间隙 [Chip material:GAASP/GAP]
分类和应用:
文件页数/大小: 3 页 / 144 K
品牌: BRIGHT [ BRIGHT LED ELECTRONICS CORP ]
 浏览型号BL-B3141-TBS18C的Datasheet PDF文件第1页浏览型号BL-B3141-TBS18C的Datasheet PDF文件第2页  
BRIGHT LED ELECTRONICS CORP.
SINCE 1981
BL-B3141-TBS18C
Tapping and packaging specifications(Units: mm)
3.0(.118)
3.8(.150)
H1--------------------18.0(.709)±0.5
5.3(.209)
L------------------------11.0(.433) Max.
Wo--------------------------------9.0(.35)
Cathode
P1------------------------------5.0(.196)
H1
W2
F--------------------------------2.54(0.1)
P-------------------------------12.5(.49)
L Wo
W1
W3
D----------------------------- 4.0(.157)
W1---------------------------10.0(.394)
P1
F
P
D
T
W2----------------------4.0(.157) Max.
W3---------------------------18.0(.708)
T-----------------------1.42(.055) Max.
TxSxxx (2.54 PITCH STRAIGHT LEADS)
USER DIRECTION OF FEED
Notes: 1.All dimensions are in millimeter (inch).
2.Tolerance is ±0.25mm (0.01”) unless otherwise specified.
3.Lead spacing is measured where the leads emerge from the package.
4.The stopper is used as the tie bar.
Bin Limits
1. Intensity Bin Limits (At I
F
= 20mA)
Bin Code
:
K
L
M
N
P
:
Bin
x
Min. (mcd)
:
11 . 0
16.0
24.0
37.0
55.0
:
Max. (mcd)
:
21.0
32.0
48.0
72.0
11 0 . 0
:
Intensity bin code
Ver.1.0 Page: 3 of 3