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BL-B3141-TBS18C 参数 Datasheet PDF下载

BL-B3141-TBS18C图片预览
型号: BL-B3141-TBS18C
PDF下载: 下载PDF文件 查看货源
内容描述: 芯片材料:砷化镓/间隙 [Chip material:GAASP/GAP]
分类和应用:
文件页数/大小: 3 页 / 144 K
品牌: BRIGHT [ BRIGHT LED ELECTRONICS CORP ]
 浏览型号BL-B3141-TBS18C的Datasheet PDF文件第2页浏览型号BL-B3141-TBS18C的Datasheet PDF文件第3页  
BRIGHT LED ELECTRONICS CORP.
SINCE 1981
BL-B3141-TBS18C
Features:
1. Chip material: GaAsP/GaP
2. Emitted color : Yellow
3. Lens Appearance : Yellow Diffused
4. Low power consumption.
5. High efficiency.
6. Versatile mounting on P.C. Board or panel.
7. Low current requirement.
8. 3mm diameter package
Package dimensions:
3.00(.118)
0.81(.032)
5.30(.209)
1.5(.059)
MAX.
25.4(1.00) MIN.
CATHODE
0.5(.02)
SQ.TYP.
3.80(.150)
Applications:
1. TV set
2. Monitor
3. Telephone
4. Computer
5. Circuit board
Notes:
2.54(.100)
NOM.
1.00(.039) MIN.
Flat Denotes Cathode
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.25mm (0.01”) unless otherwise specified.
3. Lead spacing is measured where the leads emerge from
the package.
4. Specifications are subject to change without notice.
Absolute Maximum Ratings(Ta=25℃)
Parameter
Power Dissipation
Forward Current
Peak Forward Current*
1
Reverse
Voltage
Operating Temperature
Storage Temperature
Soldering Temperature
Symbol
Pd
I
F
I
FP
V
R
Topr
Tstg
Tsol
Rating
80
30
150
5
-40
~80
-40
~85
260
(for 5 seconds)
Unit
mW
mA
mA
V
*
1
Condition for I
FP
is pulse of 1/10 duty and 0.1msec width.
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