TISP8200M & TISP8201M
MECHANICAL DATA
D008 Plastic Small Outline Package
This small-outline package consists of a circuit mounted on a lead frame and encapsulated within a plastic compound. The compound will
withstand soldering temperature with no deformation, and circuit performance characteristics will remain stable when operated in high
humidity conditions. Leads require no additional cleaning or processing when used in soldered assembly.
D008
4. 80 - 5. 00
(0.189 - 0. 19 7)
8
7
6
5
8-pin Small Outline Microelectronic Standard
Package MS-012, JEDEC Publication 95
5. 80 - 6. 20
(0.228 - 0.244)
INDEX
3. 81 - 4. 00
(0.150 - 0.157)
1
2
3
4
1. 35 - 1.75
(0.053 - 0.069)
7° N O M
3 P la ces
0. 25 - 0.50 x 45
°N
O M
(0.010 - 0.020)
4. 60 - 5.21
(0.181 - 0.205)
0. 10 2 - 0.203
(0.004 - 0.008)
0. 28 - 0.79
(0.011 - 0. 03 1)
Pin Spacing
1. 27
(0.050)
(see Note A)
6 P laces
0. 36 - 0.51
(0.014 - 0.020)
8 P laces
0. 19 0 - 0.229
(0.0075 - 0. 00 90)
7° NOM
4 P la ces
4°
±
4°
0. 51 - 1.12
(0.020 - 0.044)
DIMENSIONS ARE:
MILLIMETERS
(INCHES)
MD XXAAE
NOTES: A.
B.
C.
D.
Leads are within 0.25 (0.010) radius of true position at maximum material condition.
Body dimensions do not include mold flash or protrusion.
Mold flash or protrusion shall not exceed 0.15 (0.006).
Lead tips to be planar within
±0.051
(0.002).
MAY 1998 - REVISED FEBRUARY 2005
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
BOURNS [ BOURNS ELECTRONIC SOLUTIONS ]
