TISP4xxxH4BJ Overvoltage Protection Series
MECHANICAL DATA
SMBJ (DO-214AA)
This surface mount package consists of a circuit mounted on a lead frame and encapsulated within a plastic compound. The compound will
withstand soldering temperature with no deformation, and circuit performance characteristics will remain stable when operated in high
humidity conditions. Leads require no additional cleaning or processing when used in soldered assembly.
SMB
4.06 - 4.57
(.160 - .180)
3.30 - 3.94
(.130 - .155)
2
Index
Mark
(if needed)
METRIC
DIMENSIONS ARE:
(INCHES)
2.00 - 2.40
(.079 - .094)
1.90 - 2.10
(.075 - .083)
1.96 - 2.32
(.077 - .091)
0.10 - 0.20
(.004 - .008)
0.76 - 1.52
(.030 - .060)
5.21 - 5.59
(.205 - .220)
MDXXBHA
NOVEMBER 1997 - REVISED FEBRUARY 2005
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
BOURNS [ BOURNS ELECTRONIC SOLUTIONS ]
