ABSOLUTE MAXIMUM RATINGS
PIN CONFIGURATION
Supply Voltage .................................................................................. ±18V
Analog Input Voltage Range ............................................................. ±40V
Logic Input Voltage Range .................................................................. ±VS
Output Short-Circuit (to ground) .............................................. Continuous
Operating Temperature ................................................. –40°C to +125°C
Storage Temperature..................................................... –40°C to +125°C
Junction Temperature .................................................................... +150°C
Lead Temperature (soldering –10s) .............................................. +300°C
Top View
DIP
SOL-16
VO1
NC
1
2
3
4
5
6
7
8
16 A1
15 A0
NC
14 Dig. Ground
13 V+
VI–N
ORDERING INFORMATION
VI+N
12 Sense
11 VO
TEMPERATURE
PRODUCT
PGA206PA 1, 2, 4, 8V/V
PGA206P 1, 2, 4, 8V/V
GAINS
PACKAGE
RANGE
VOS Adjust
VOS Adjust
V–
16-Pin Plastic DIP
16-Pin Plastic DIP
–40°C to +85°C
–40°C to +85°C
10 Ref
PGA206UA 1, 2, 4, 8V/V SOL-16 Surface-Mount –40°C to +85°C
PGA206U 1, 2, 4, 8V/V SOL-16 Surface-Mount –40°C to +85°C
9
VO2
PGA207PA 1, 2, 5, 10V/V
PGA207P 1, 2, 5, 10V/V
16-Pin Plastic DIP
16-Pin Plastic DIP
–40°C to +85°C
–40°C to +85°C
NC: No Internal Connection
PGA207UA 1, 2, 5, 10V/V SOL-16 Surface-Mount –40°C to +85°C
PGA207U
1, 2, 5, 10V/V SOL-16 Surface-Mount –40°C to +85°C
PACKAGE INFORMATION
PACKAGE DRAWING
NUMBER(1)
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Burr-Brown
recommends that all integrated circuits be handled with ap-
propriate precautions. Failure to observe proper handling and
installation procedures can cause damage.
PRODUCT
PACKAGE
PGA206PA
PGA206P
PGA206UA
PGA206U
16-Pin Plastic DIP
16-Pin Plastic DIP
SOL-16 Surface Mount
SOL-16 Surface Mount
180
180
211
211
PGA207PA
PGA207P
PGA207UA
PGA207U
16-Pin Plastic DIP
16-Pin Plastic DIP
SOL-16 Surface Mount
SOL-16 Surface Mount
180
180
211
211
ESD damage can range from subtle performance degradation
to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric
changes could cause the device not to meet its published
specifications.
NOTE: (1) For detailed drawing and dimension table, please see end of data
sheet, or Appendix C of Burr-Brown IC Data Book.
®
3
PGA206/207
BB [ BURR-BROWN CORPORATION ]
