PIN CONFIGURATIONS
Top View
TO-100
DIP
G and P Package
M Package
–In
Output
+VCC
1
2
3
4
5
6
7
14 Common
13 –VCC
10
Gain Set
+VCC
1
4
9
6
–Input
12 +Input
Offset
Adjust
Output
2
3
8
7
Gain Sense 1
Gain Set 1
Offset Adj.
Offset Adj.
11 Gain Sense 2
10 Gain Set 2
SOIC
U Package
Offset
Adjust
Common
9
8
A2 Output
A1 Output
Gain
Set
–VCC
Output
+VCC
1
2
3
4
5
6
7
8
16 Common
15 –VCC
5
+In
–Input
14 +Input
Gain Sense 1
Gain Set 1
Offset Adj.
Offset Adj.
NC
13 Gain Sense 2
12 Gain Set 2
11 A2 Output
10 A1 Output
9
NC
ORDERING INFORMATION
ABSOLUTE MAXIMUM RATINGS
PRODUCT
PACKAGE
TEMPERATURE RANGE
Supply Voltage ................................................................................... ±20V
Power Dissipation .......................................................................... 600mW
Input Voltage Range .......................................................................... ±VCC
Output Short Circuit (to ground) ............................................... Continuous
Operating Temperature M, G Package ........................... –55°C to +125°C
P, U Package ................................................................. –25°C to +85°C
Storage Temperature M, G Package .............................. –65°C to +150°C
P, U Package ................................................................. –40°C to +85°C
Lead Temperature (soldering, 10s) M, G, P Package ................... +300°C
Lead Temperature (wave soldering, 3s) U Package...................... +260°C
INA101AM
INA101CM
INA101AG
INA101CG
INA101HP
INA101KU
INA101SG
INA101SM
10-Pin Metal TO-100
10-Pin Metal TO-100
14-Pin Ceramic DIP
14-Pin Ceramic DIP
14-Pin Plastic DIP
SOL-16 Surface-Mount
14-Pin Ceramic DIP
10-Pin Metal TO-100
–25°C to +85°C
–25°C to +85°C
–25°C to +85°C
–25°C to +85°C
0°C to +70°C
0°C to +70°C
–55°C to +125°C
–55°C to +125°C
PACKAGE INFORMATION
ELECTROSTATIC
DISCHARGE SENSITIVITY
PACKAGE DRAWING
NUMBER(1)
PRODUCT
PACKAGE
INA101AM
INA101CM
INA101AG
INA101CG
INA101HP
INA101KU
INA101SG
INA101SM
10-Pin Metal TO-100
10-Pin Metal TO-100
14-Pin Ceramic DIP
14-Pin Ceramic DIP
14-Pin Plastic DIP
SOL-16 Surface-Mount
14-Pin Ceramic DIP
10-Pin Metal TO-100
007
007
169
169
010
211
169
007
This integrated circuit can be damaged by ESD. Burr-Brown
recommends that all integrated circuits be handled with ap-
propriate precautions. Failure to observe proper handling and
installation procedures can cause damage.
ESD damage can range from subtle performance degradation
to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric
changes could cause the device not to meet its published
specifications.
NOTE: (1) For detailed drawing and dimension table, please see end of data
sheet, or Appendix D of Burr-Brown IC Data Book.
The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN assumes
no responsibility for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject to change
without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not authorize or warrant
any BURR-BROWN product for use in life support devices and/or systems.
®
3
INA101
BB [ BURR-BROWN CORPORATION ]
