PACKAGE OPTION ADDENDUM
www.ti.com
12-Jan-2010
PACKAGING INFORMATION
Orderable Device
ADS7825P
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
PDIP
NT
28
28
28
28
28
28
28
28
28
28
28
28
28
28
13 Green (RoHS & CU NIPDAU N / A for Pkg Type
no Sb/Br)
ADS7825PB
PDIP
PDIP
PDIP
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
NT
NT
13 Green (RoHS & CU NIPDAU N / A for Pkg Type
no Sb/Br)
ADS7825PBG4
ADS7825PG4
ADS7825U
13 Green (RoHS & CU NIPDAU N / A for Pkg Type
no Sb/Br)
NT
13 Green (RoHS & CU NIPDAU N / A for Pkg Type
no Sb/Br)
DW
DW
DW
DW
DW
DW
DW
DW
DW
DW
20 Green (RoHS & CU NIPDAU Level-3-260C-168 HR
no Sb/Br)
ADS7825U/1K
ADS7825U/1KE4
ADS7825UB
1000 Green (RoHS & CU NIPDAU Level-3-260C-168 HR
no Sb/Br)
1000 Green (RoHS & CU NIPDAU Level-3-260C-168 HR
no Sb/Br)
20 Green (RoHS & CU NIPDAU Level-3-260C-168 HR
no Sb/Br)
ADS7825UB/1K
ADS7825UB/1KE4
ADS7825UBE4
ADS7825UBG4
ADS7825UE4
ADS7825UG4
1000 Green (RoHS & CU NIPDAU Level-3-260C-168 HR
no Sb/Br)
1000 Green (RoHS & CU NIPDAU Level-3-260C-168 HR
no Sb/Br)
20 Green (RoHS & CU NIPDAU Level-3-260C-168 HR
no Sb/Br)
20 Green (RoHS & CU NIPDAU Level-3-260C-168 HR
no Sb/Br)
20 Green (RoHS & CU NIPDAU Level-3-260C-168 HR
no Sb/Br)
20 Green (RoHS & CU NIPDAU Level-3-260C-168 HR
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
Addendum-Page 1
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