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SLAS499–JANUARY 2007
PowerPAD PACKAGE
The PowerPAD package is a thermally enhanced standard size IC package designed to eliminate the use of
bulky heatsinks and slugs traditionally used in thermal packages. This package can be easily mounted using
standard printed circuit board (PCB) assembly techniques and can be removed and replaced using standard
repair procedures.
The PowerPAD package is designed so that the lead frame die pad (or thermal pad) is exposed on the bottom
of the IC. This provides a low thermal resistance path between the die and the exterior of the package. The
thermal pad on the bottom of the IC can then be soldered directly to the printed circuit board (PCB), using the
PCB as a heatsink.
Assembly Process
1. Prepare the PCB top-side etch pattern including etch for the leads as well as the thermal pad as
illustrated in the Mechanical Data section. The recommended thermal pad dimension is 8 mm x 8 mm.
2. Place a 5-by-5 array of thermal vias in the thermal pad area. These holes should be 13 mils in diameter.
The small size prevents wicking of the solder through the holes.
3. It is recommended to place a small number of 25 mil diameter holes under the package, but outside the
thermal pad area to provide an additional heat path.
4. Connect all holes (both those inside and outside the thermal pad area) to an internal copper plane (such
as a ground plane).
5. Do not use the typical web or spoke via connection pattern when connecting the thermal vias to the
ground plane. The spoke pattern increases the thermal resistance to the ground plane.
6. The top-side solder mask should leave exposed the terminals of the package and the thermal pad area.
7. Cover the entire bottom side of the PowerPAD vias to prevent solder wicking.
8. Apply solder paste to the exposed thermal pad area and all of the package terminals.
For more detailed information regarding the PowerPAD package and its thermal properties, see either the
application brief SLMA004B (PowerPAD Made Easy) or technical brief SLMA002 (PowerPAD Thermally
Enhanced Package).
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