PACKAGE DRAWING
PAP (S-PQFP-G64)
MPQF071 – JANUARY 1998
PowerPAD PLASTIC QUAD FLATPACK
0,27
0,17
M
0,50
48
0,08
33
49
32
Thermal Pad
(See Note D)
64
17
0,13 NOM
1
16
7,50 TYP
Gage Plane
10,20
SQ
9,80
12,20
SQ
0,25
11,80
0,15
0,05
0°–7°
1,05
0,95
0,75
0,45
Seating Plane
0,08
1,20 MAX
4147702/A 01/98
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion.
D. The package thermal performance may be enhanced by bonding the thermal pad to an external thermal plane.
This pad is electrically and thermally connected to the backside of the die and possibly selected leads.
E. Falls within JEDEC MS-026
ADS2806
SBAS178B
17
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