2. Qualify improved mold compound to achieve better moisture sensitivity level (from MSL 4 to MSL 3)
and
3. Qualify new leadframe base material to improve matching of coefficient of thermal expansion
Parts Affected:
HFBR-2505CFZ
HFBR-2505CZ
HFBR-2521Z
HFBR-2522Z
HFBR-2523Z
HFBR-2523Z-00A
HFBR-2524Z
HFBR-2531Z
HFBR-2532Z
HFBR-2533Z
HFBR-2541Z
QFBR-2548Z
QFBR-2551Z
QFBR-2573Z
QFBR-521RZ
QFBR-R521Z
QFBR-R531Z
QFBR-TR04Z
QFBR-TR05Z
QFBR-TR10Z
QFBR-5591Z
QFBR-5592Z
QFBR-5594Z
QFBR-5595Z
4. Qualify alternate photo diode supplier and improved mold compound:
Parts Affected:
QFBR-R518Z
HFBR-2510Z
HFBR-2526Z
HFBR-2536Z
Reasons for Changes:
1. Improved mold compound:
to improve moisture sensitivity level from MSL 4 to MSL 3 and to harmonize the mold compound in use.
The improved mold compound has been qualified and used in other Avago products since 2007.
2. New leadframe base material:
to improve the matching of coefficient-of-thermal-expansion. Lead frame layout remains unchanged. All
other 650nm transmitters from Avago have been qualified and shipped with this lead frame material for
more than 15 years.
3. New photodiode:
to qualify alternative photo diode supplier. The alternate supplier and its photo diode is already qualified
and used in other Avago products since 2007.
Effect of Change on Fit, Form, Function, Quality or Reliability:
Reliability qualifications have been performed to ensure product reliability before the implementation date.
Detailed product characterizations were performed to ensure product compliance to datasheet.
AVAGO [ AVAGO TECHNOLOGIES LIMITED ]
