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HCPL-570K#100 参数 Datasheet PDF下载

HCPL-570K#100图片预览
型号: HCPL-570K#100
PDF下载: 下载PDF文件 查看货源
内容描述: [1 CHANNEL LOGIC OUTPUT OPTOCOUPLER, 0.1Mbps, HERMETIC SEALED, CERAMIC, DIP-8]
分类和应用: 输出元件光电
文件页数/大小: 12 页 / 201 K
品牌: AVAGO [ AVAGO TECHNOLOGIES LIMITED ]
 浏览型号HCPL-570K#100的Datasheet PDF文件第1页浏览型号HCPL-570K#100的Datasheet PDF文件第2页浏览型号HCPL-570K#100的Datasheet PDF文件第3页浏览型号HCPL-570K#100的Datasheet PDF文件第4页浏览型号HCPL-570K#100的Datasheet PDF文件第6页浏览型号HCPL-570K#100的Datasheet PDF文件第7页浏览型号HCPL-570K#100的Datasheet PDF文件第8页浏览型号HCPL-570K#100的Datasheet PDF文件第9页  
Hermetic Optocoupler Options
Option
100
Description
Surface mountable hermetic optocoupler with leads trimmed for butt joint assembly. This option is available on com-
mercial and hi-rel product in 8 and 16 pin DIP (see drawings below for details).
4.32 (0.170)
MAX.
0.51 (0.020)
MIN.
2.29 (0.090)
2.79 (0.110)
1.14 (0.045)
1.40 (0.055)
0.51 (0.020)
MAX.
4.32 (0.170)
MAX.
0.51 (0.020)
MIN.
2.29 (0.090)
2.79 (0.110)
1.14 (0.045)
1.40 (0.055)
0.51 (0.020)
MAX.
0.20 (0.008)
0.33 (0.013)
7.36 (0.290)
7.87 (0.310)
Note: Dimensions in Millimeters (Inches).
200
Lead finish is solder dipped rather than gold plated. This option is available on commercial and hi-rel product in 8 and
16 pin DIP. DLA Drawing part numbers contain provisions for lead finish. All leadless chip carrier devices are delivered
with solder dipped terminals as a standard feature.
Surface mountable hermetic optocoupler with leads cut and bent for gull wing assembly. This option is available on
commercial and hi-rel product in 8 and 16 pin DIP (see drawings below for details). This option has solder dipped
leads.
4.57
(0.180)
MAX.
0.51 (0.020)
MIN.
2.29
(0.090)
2.79
(0.110)
1.40 (0.055)
1.65 (0.065)
0.51 (0.020)
MAX.
300
4.57
(0.180)
MAX.
0.51 (0.020)
MIN.
2.29
(0.090)
2.79
(0.110)
0.20 (0.008)
0.33 (0.013)
9.65 (0.380)
9.91 (0.390)
4.57
(0.180)
MAX.
1.40 (0.055)
1.65 (0.065)
0.51 (0.020)
MAX.
MAX.
1.07 (0.042)
1.32 (0.052)
Note: Dimensions in Millimeters (Inches).
600
Surface mountable hermetic optocoupler with leads trimmed for butt joint assembly. This option is available on com-
mercial and hi-rel product in 8 and 16 pin DIP (see drawings below for details). Contact factory for the availability of this
option on DLA part types.
3.81 (0.150)
MIN.
MAX.
0.51 (0.020)
MIN.
0.20 (0.008)
0.33 (0.013)
2.29 (0.090)
2.79 (0.110)
1.14 (0.045)
1.25 (0.049)
7.36 (0.290)
7.87 (0.310)
3.81 (0.150)
MAX.
0.51 (0.020)
MIN.
2.29 (0.090)
2.79 (0.110)
1.02 (0.040)
TYP.
Note: Dimensions in Millimeters (Inches).
Solder contains lead.
5