Functional Diagrams
16 pin DIP
Through Hole
4 Channels
1
2
16
8 pin DIP
Through Hole
1 Channel
1
8
8 pin DIP
Through Hole
2 Channels
1
8
16 pin Flat Pack
Unformed Leads
4 Channels
1
2
16
20 Pad LCCC
Surface Mount
2 Channels
15
VCC2
19
VO2
GND2
13
12
10
15
2
7
2
7
15
15
14
14
13
20
2
3
GND1
7
3
14
13
12
11
10
9
3
6
3
6
3
4
5
6
7
VCC1
4
5
6
4
5
4
5
VO1
8
12
11
7
8
10
9
8
Note: All DIP and flat pack devices have common V
CC
and ground. LCCC (leadless ceramic chip carrier) package has isolated channels with separate
V
CC
and ground connections.
Outline Drawings
16 Pin DIP Through Hole, 4 Channels
20.06 (0.790)
20.83 (0.820)
0.89 (0.035)
1.65 (0.065)
4.45 (0.175)
MAX.
8.13 (0.320)
MAX.
0.51 (0.020)
MIN.
3.81 (0.150)
MIN.
0.20 (0.008)
0.33 (0.013)
2.29 (0.090)
2.79 (0.110)
0.51 (0.020)
MAX.
7.36 (0.290)
7.87 (0.310)
Note: Dimensions in Millimeters (Inches)
Leaded Device Marking
Avago LOGO
Avago P/N
DLA SMD*
DLA SMD*
PIN ONE/
ESD IDENT
A QYYWWZ
XXXXXX
XXXXXXX
XXX XXX
50434
*QUALIFIED PARTS ONLY
COMPLIANCE INDICATOR,*
DATE CODE, SUFFIX (IF NEEDED)
COUNTRY OF MFR.
Avago CAGE CODE*
Leadless Device Marking
Avago LOGO
Avago P/N
PIN ONE/
ESD IDENT
COUNTRY OF MFR.
A QYYWWZ
XXXXXX
XXXX
XXXXXX
XXX
50434
COMPLIANCE INDICATOR,*
DATE CODE, SUFFIX (IF NEEDED)
DLA SMD*
DLA SMD*
Avago CAGE CODE*
3
AVAGO [ AVAGO TECHNOLOGIES LIMITED ]
