Solder Reflow Temperature Profile
300
PREHEATING RATE 3 °C + 1 °C/–0.5 °C/SEC.
REFLOW HEATING RATE 2.5 °C 0.5 °C/SEC.
PEAK
TEMP.
245 °C
PEAK
TEMP.
240 °C
PEAK
TEMP.
230 °C
200
100
0
2.5 C 0.5 °C/SEC.
SOLDERING
30
TIME
160 °C
150 °C
140 °C
SEC.
200 °C
30
SEC.
3 °C + 1 °C/–0.5 °C
PREHEATING TIME
150 °C, 90 + 30 SEC.
50 SEC.
TIGHT
TYPICAL
LOOSE
ROOM
TEMPERATURE
0
50
100
150
200
250
TIME (SECONDS)
NOTE: NON-HALIDE FLUX SHOULD BE USED.
Recommended Pb-Free IR Profile
TIMEWITHIN 5 °C of ACTUAL
PEAKTEMPERATURE
tp
15 SEC.
* 260 +0/-5 °C
RAMP-UP
Tp
217 °C
TL
RAMP-DOWN
6 °C/SEC. MAX.
3 °C/SEC. MAX.
150 - 200 °C
Tsmax
Tsmin
ts
tL
PREHEAT
60 to 150 SEC.
60 to 180 SEC.
25
t 25 °C to PEAK
TIME
NOTES:
THETIME FROM 25 °C to PEAKTEMPERATURE = 8 MINUTES MAX.
Tsmax = 200 °C, Tsmin = 150 °C
NOTE: NON-HALIDE FLUX SHOULD BE USED.
* RECOMMENDED PEAKTEMPERATURE FORWIDEBODY 400mils PACKAGE IS 245 °C
6
AVAGO [ AVAGO TECHNOLOGIES LIMITED ]
