8-Pin Widebody DIP Package with Gull Wing Surface Mount Option 300
(HCNW137, HCNW2601/11)
11.23 0.15
(0.442 0.006)
LAND PATTERN RECOMMENDATION
7
6
5
8
9.00 0.15
(0.354 0.006)
13.56
(0.534)
1
3
2
4
2.29
(0.09)
1.3
(0.051)
12.30 0.30
1.55
(0.061)
MAX.
(0.484 0.012)
11.00
MAX.
(0.433)
4.00
MAX.
(0.158)
1.80 0.15
(0.071 0.006)
1.00 0.15
(0.039 0.006)
0.75 0.25
(0.030 0.010)
+ 0.076
- 0.0051
2.54
(0.100)
BSC
0.254
+ 0.003)
- 0.002)
(0.010
DIMENSIONS IN MILLIMETERS (INCHES).
7° NOM.
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
Solder Reflow Temperature Profile
300
PREHEATING RATE 3 °C + 1 °C/–0.5 °C/SEC.
REFLOW HEATING RATE 2.5 °C 0.5 °C/SEC.
PEAK
TEMP.
245 °C
PEAK
TEMP.
240 °C
PEAK
TEMP.
230 °C
200
100
0
2.5 C 0.5 °C/SEC.
SOLDERING
30
TIME
160 °C
150 °C
140 °C
SEC.
200 °C
30
SEC.
3 °C + 1 °C/–0.5 °C
PREHEATING TIME
150 °C, 90 + 30 SEC.
50 SEC.
TIGHT
TYPICAL
LOOSE
ROOM
TEMPERATURE
0
50
100
150
200
250
TIME (SECONDS)
NOTE: NON-HALIDE FLUX SHOULD BE USED.
7
AVAGO [ AVAGO TECHNOLOGIES LIMITED ]
