Absolute Maximum Ratings* (No Derating Required up to 85°C)
Parameter
Storage Temperature
Symbol
TS
Min.
-55
Max.
125
85
Units
°C
Operating Temperature**
Average Forward Input Current
Peak Forward Input Current
(50% Duty Cycle, 1 ms Pulse Width)
Peak Transient Input Current
(<1 μs Pulse Width, 300 pps)
Reverse Input Voltage
T
-40
°C
A
IF(AVG)
IFPK
20
mA
mA
40
IF(TRAN)
VR
1.0
A
5
3
V
V
HCNW139/138
Input Power Dissipation
Output Current (Pin 6)
PI
IO
35
60
0.5
mW
mA
V
Emitter Base Reverse Voltage (Pin 5-7)
VEB
Supply Voltage and Output Voltage
(6N139, HCPL-0701, HCNW139)
Supply Voltage and Output Voltage
(6N138, HCPL-0700, HCNW138)
Output Power Dissipation
V
-0.5
-0.5
18
7
V
V
CC
V
CC
PO
PT
100
135
mW
mW
Total Power Dissipation
Lead Solder Temperature (for Through Hole Devices)
HCNW139/138
260°C for 10 sec., 1.6 mm below seating plane
260°C for 10 sec., up to seating plane
See Package Outline Drawings section
Reflow Temperature Profile
(for SOIC-8 and Option #300)
*JEDEC Registered Data for 6N139 and 6N138.
**0°C to 70°C on JEDEC Registration.
Recommended Operating Conditions
Parameter
Symbol
Min.
4.5
0.5
0
Max.
18
Units
Power Supply Voltage
Forward Input Current (ON)
Forward Input Voltage (OFF)
Operating Temperature
V
V
mA
V
CC
IF(ON)
12.0
0.8
VF(OFF)
T
0
70
°C
A
9
AVAGO [ AVAGO TECHNOLOGIES LIMITED ]
