Selection for lower input current down to 250 μA is
available upon request.
footprint area of the standard dual-in-line package. The
lead profile is designed to be compatible with standard
surface mount processes.
The HCPL-0701 and HCPL-0700 are surface mount devices
packaged in an industry standard SOIC-8 footprint.
The HCNW139 and HCNW138 are packaged in a
widebody encapsulation that provides creepage and
clearance dimensions suitable for safety approval by
regulatory agencies worldwide.
The SOIC-8 does not require “through holes” in a PCB.
This package occupies approximately one-third the
Selection Guide
Widebody
Package
(400 mil)
8-Pin DIP
(300 Mil)
Hermetic
Single and
Dual
Channel
Packages
HCPL-
Small Outline SO-8
Dual
Single
Channel
Package
HCPL-
Dual
Minimum
Input ON
Current
(IF)
Absolute
Maxi-
mum
Single
Channel
Package
Channel
Package
HCPL-
Channel
Package
HCPL-
Single
Channel
Package
Minimum
CTR
V
CC
6N139
2731[1]
2730[1]
4731[1]
0701
0731
HCNW139
HCNW138
0.5 mA
1.6 mA
40 μA
400%
300%
800%
300%
18 V
7 V
6N138
HCPL-4701[1]
0700
070A[1]
0730
073A[1]
18 V
20 V
0.5 mA
5701[1]
5700[1]
5731[1]
5730[1]
Note:
1. Technical data are on separate Avago publications.
2
AVAGO [ AVAGO TECHNOLOGIES LIMITED ]
