EEPROM
AS28C010
Austin Semiconductor, Inc.
MECHANICAL DEFINITIONS*
NOTES:
1.
Symbol Min Max Note Symbol Min Max Note
Index area: A notch or a pin one identification mark shall be located
adjacent to pin one and shall be located within the shaded area shown.
The manufacturer’s identification shall not be used as a pin one
identification mark.
The maximum limits of lead dimensions b and c or M shall be measured
at the centroid of the finished lead surfaces, when solder dip or tin plate
lead finish is applied.
Dimensions b1 and c1 apply to lead base metal only. Dimension M applies
to lead plating and finish thickness.
The b2 minimum dimension of .045 inch (1.14 mm) was implemented 30
September 1992. Until that date, a minimum dimension of .038 (0.97 mm)
was acceptable. See 5.2.4
Corner leads (1, N, N/2, and N/2+1) may be configured as shown in detail
A. For this configuration dimension b3 replaces dimension b2.
This dimension allows for off-center lid, meniscus, and glass overrun.
Pointed or rounded lead tips as shown in details B and C are preferred to
ease insertion, but are not mandatory.
A
b
--- .225
.014 .026
.014 .023
.045 .065
.023 .045
.008 .018
.008 .015
--- 1.680
.510 .620
eA/2
L
.300 BSC
.125 .200
.015 .070
2
3
4
5
2
3
6
6
8
9
b1
b2
b3
c
Q
2.
Q1
S1
S2
a
.005 ---
.005 ---
90O 105O
--- .015
--- .030
--- .010
--- .0015
32
10
11
3.
4.
c1
D
aaa
bbb
ccc
M
5.
E
6.
8.
E2
E3
e
2
9.
Dimension Q shall be measured from the seating plane to the base plane.
N
12
.100 BSC
.600 BSC
10. Measure dimension S1 at all four corners, see 5.2.5.
11. Measure dimension S2 from the top of the ceramic body to the nearest
metallization or lead
eA
Note
1,14
12. N is the maximum number of terminal positions.
14. See tables VI and VII for descriptive type designators.
*All measurements are in inches.
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.
AS28C010
Rev. 1.5 5/06
12
AUSTIN [ AUSTIN SEMICONDUCTOR ]
