AT40K/AT40KLV Series FPGA
144L1 – LQFP
D1
D
XX
e
E1
E
N
b
Bottom View
Top View
COMMON DIMENSIONS
(Unit of Measure = mm)
MIN
0.05
1.35
MAX
0.15
1.45
NOM
NOTE
SYMBOL
A1
A2
D
6
A2
1.40
22.00 BSC
20.00 BSC
22.00 BSC
20.00 BSC
0.50 BSC
0.22
A1
D1
E
2, 3
2, 3
4, 5
L1
Side View
E1
e
b
0.17
0.27
L1
1.00 REF
1. This drawing is for general information only; refer to JEDEC Drawing MS-026 for additional information.
2. The top package body size may be smaller than the bottom package size by as much as 0.15 mm.
Notes:
3. Dimensions D1 and E1 do not include mold protrusions. Allowable protrusion is 0.25 mm per side. D1 and E1 are maximum plastic
body size dimensions including mold mismatch.
4. Dimension b does not include Dambar protrusion. Allowable Dambar protrusion shall not cause the lead width to exceed the maximum
b dimension by more than 0.08 mm. Dambar cannot be located on the lower radius or the foot. Minimum space between protrusion and
an adjacent lead is 0.07 mm for 0.4 and 0.5 mm pitch packages.
5. These dimensions apply to the flat section of the lead between 0.10 mm and 0.25 mm from the lead tip.
6. A1 is defined as the distance from the seating place to the lowest point on the package body.
11/30/01
TITLE
144L1, 144-lead (20 x 20 x 1.4 mm Body), Low Profile
Plastic Quad Flat Pack (LQFP)
DRAWING NO.
REV.
2325 Orchard Parkway
San Jose, CA 95131
144L1
A
R
61
0896C–FPGA–04/02