ASL51S9
4. Package Outline (SOT89, 4.5x4.0x1.5 mm)
Part No.
Lot No.
Dimensions (In mm)
Symbols
MIN
1.40
0.89
0.36
0.41
0.38
4.40
1.40
3.64
2.40
2.90
0.35
0.65
1.40
NOM
1.50
1.04
0.42
0.47
0.40
4.50
1.60
---
2.50
3.00
0.40
0.75
1.50
MAX
1.60
1.20
0.48
0.53
0.43
4.60
1.75
4.25
2.60
3.10
0.45
0.85
1.60
A
L
b
b1
C
D
D1
E
E1
e1
H
ASL51S9
Pxxxx
S
e
5. Surface Mount Recommendation (In mm)
NOTE
1. The number and size of ground via holes in a circuit
board are critical for thermal and RF grounding
considerations.
2. Recommended is that the ground via holes be
placed on the bottom of the lead pin 2 and exposed
pad of the device for better RF and thermal
performance, as shown in the drawing at the left
side.
7/8
ASB Inc.
sales@asb.co.kr
January 2017
ASB [ ADVANCED SEMICONDUCTOR BUSINESS INC. ]
