AO6601
P-Channel Electrical Characteristics (T
J
=25° unless otherwise noted)
C
Symbol
Parameter
Conditions
Min
-30
-1
Typ
Max
Units
V
-5
±100
-0.6
-15
88
115
200
150
200
-1
-1.5
205
V
GS
=0V, V
DS
=-15V, f=1MHz
V
GS
=0V, V
DS
=0V, f=1MHz
25
10
4
4.5
V
GS
=10V, V
DS
=-15V, I
D
=-2.3A
2
260
37
20
8
5.9
2.8
0.7
1
6
V
GS
=10V, V
DS
=-15V, R
L
=6Ω,
R
GEN
=3Ω
I
F
=-2.3A, dI/dt=100A/µs
1in
2
STATIC PARAMETERS
Drain-Source Breakdown Voltage
BV
DSS
I
DSS
I
GSS
V
GS(th)
I
D(ON)
Zero Gate Voltage Drain Current
Gate-Body leakage current
Gate Threshold Voltage
On state drain current
I
D
=-250µA, V
GS
=0V
V
DS
=-30V, V
GS
=0V
T
J
=55°C
V
DS
=0V, V
GS
=±12V
µA
nA
V
A
V
DS
=V
GS
I
D
=-250µA
V
GS
=-10V, V
DS
=-5V
V
GS
=-10V, I
D
=-2.3A
T
J
=125°C
V
GS
=-4.5V, I
D
=-2A
V
GS
=-2.5V, I
D
=-1A
V
DS
=-5V, I
D
=-2.3A
I
S
=-1A,V
GS
=0V
-1
-1.4
R
DS(ON)
Static Drain-Source On-Resistance
143
103
139
8
-0.78
mΩ
mΩ
mΩ
S
V
A
pF
pF
pF
Ω
nC
nC
nC
nC
ns
ns
ns
ns
g
FS
V
SD
I
S
Forward Transconductance
Diode Forward Voltage
Maximum Body-Diode Continuous Current
DYNAMIC PARAMETERS
C
iss
Input Capacitance
C
oss
C
rss
R
g
Output Capacitance
Reverse Transfer Capacitance
Gate resistance
315
50
30
12
7
4
SWITCHING PARAMETERS
Q
g
(10V) Total Gate Charge
Q
g
(4.5V) Total Gate Charge
Q
gs
Q
gd
t
D(on)
t
r
t
D(off)
t
f
t
rr
Q
rr
Gate Source Charge
Gate Drain Charge
Turn-On DelayTime
Turn-On Rise Time
Turn-Off DelayTime
Turn-Off Fall Time
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge I
F
=-2.3A, dI/dt=100A/µs
3.5
20
5
11.5
4.5
15
6
ns
nC
A. The value of R
θJA
is measured with the device mounted on
FR-4 board with 2oz. Copper, in a still air environment with T
A
=25°C. The
value in any given application depends on the user's specific board design.
B. The power dissipation P
D
is based on T
J(MAX)
=150°C, using
≤
10s junction-to-ambient thermal resistance.
C. Repetitive rating, pulse width limited by junction temperature T
J(MAX)
=150°C. Ratings are based on low frequency and duty cycles to keep
initialT
J
=25°C.
D. The R
θJA
is the sum of the thermal impedence from junction to lead R
θJL
and lead to ambient.
E. The static characteristics in Figures 1 to 6 are obtained using <300µs pulses, duty cycle 0.5% max.
F. These curves are based on the junction-to-ambient thermal impedence which is measured with the device mounted on 1in
2
FR-4 board with
2oz. Copper, assuming a maximum junction temperature of T
J(MAX)
=150°C. The SOA curve provides a single pulse rating.
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,
FUNCTIONS AND RELIABILITY WITHOUT NOTICE.
Rev 6: Dec. 2012
www.aosmd.com
Page 6 of 9
AOSMD [ ALPHA & OMEGA SEMICONDUCTORS ]
