APW1172
Layout Consideration
1. Please solder the Exposed Pad on the PCB.The heat generated by the power consumption will conduct by
the thermal pad.
2. Please place the input capacitors for VCC pin nearly as close as possible.
3. Connect the switching inductor and the Schottky diode and OUT pin by a wide track.
4. Place the output capacitor close to the inductor as possible and with a wide and short track.
5.The thermal pad is needed to improve the power dissipation.
VREF = 3.3V
VOUT = 3.3V
1
2
3
4
8
7
6
5
OUT
VCC
GND
VREF
FB
L
SYNC
INH
22uH
COMP
RC1
4.3K
APW1172
D1
1N5819
COUT
100uF
CIN
22uF
VIN
4.8V to 22V
RF2
3.3K
RF1
5.6K
CC1
CC2
2.2nF
220pF
Copyright ã ANPEC Electronics Corp.
17
www.anpec.com.tw
Rev. A.4 - Aug., 2005
ANPEC [ ANPEC ELECTRONICS COROPRATION ]
