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APM2300AA 参数 Datasheet PDF下载

APM2300AA图片预览
型号: APM2300AA
PDF下载: 下载PDF文件 查看货源
内容描述: N沟道增强型MOSFET [N-Channel Enhancement Mode MOSFET]
分类和应用:
文件页数/大小: 10 页 / 115 K
品牌: ANPEC [ ANPEC ELECTRONICS COROPRATION ]
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APM2300AA  
Physical Specifications  
Terminal Material  
Lead Solderability  
Solder-Plated Copper (Solder Material : 90/10 or 63/37 SnPb), 100%Sn  
Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3.  
Reflow Condition (IR/Convection or VPR Reflow)  
tp  
TP  
Critical Zone  
TL to TP  
Ramp-up  
TL  
tL  
Tsmax  
Tsmin  
Ramp-down  
ts  
Preheat  
25  
°
t 25 C to Peak  
Tim e  
Classification Reflow Profiles  
Profile Feature  
Average ramp-up rate  
(TL to TP)  
Sn-Pb Eutectic Assembly  
Pb-Free Assembly  
3°C/second max.  
3°C/second max.  
Preheat  
100°C  
150°C  
60-120 seconds  
150°C  
200°C  
60-180 seconds  
- Temperature Min (Tsmin)  
- Temperature Max (Tsmax)  
- Time (min to max) (ts)  
Time maintained above:  
- Temperature (TL)  
183°C  
60-150 seconds  
217°C  
60-150 seconds  
- Time (tL)  
Peak/Classificatioon Temperature (Tp)  
See table 1  
See table 2  
Time within 5°C of actual  
Peak Temperature (tp)  
10-30 seconds  
20-40 seconds  
Ramp-down Rate  
6°C/second max.  
6°C/second max.  
6 minutes max.  
8 minutes max.  
Time 25°C to Peak Temperature  
Notes: All temperatures refer to topside of the package .Measured on the body surface.  
Copyright ANPEC Electronics Corp.  
Rev. B.1 - Mar., 2005  
8
www.anpec.com.tw