APA2057A
Package Information
TSSOP-28P
D
SEE VIEW A
D1
EXPOS
ED PAD
e
b
c
GAUGE PLANE
SEATING PLANE
L
VIEW A
TSSOP-28P
S
Y
M
B
O
L
MILLIMETERS
IINNCCHHEESS
MIN.
MAX.
1.20
0.15
1.05
0.30
0.20
9.80
7.00
MIN.
MAX.
0.047
0.006
0.041
0.012
0.008
0.386
0.276
A
0.002
0.031
0.007
0.004
0.378
0.130
A1
A2
b
0.05
0.80
0.19
0.09
9.60
3.30
c
D
D1
E
E1
E2
e
6.40 BSC
0.65 BSC
0.252 BSC
0.026 BSC
0.169
0.059
0.177
0.157
4.30
1.50
4.50
4.00
0.018
0.030
L
0.45
0
0.75
0
8
0
8
Note : 1. Followed from JEDEC MO-153 AET.
2. Dimension "D" does not include mold flash, protrusions
or gate burrs. Mold flash, protrusion or gate burrs shall not
exceed 6 mil per side.
3. Dimension "E1" does not include inter-lead flash or protrusions.
Inter-lead flash and protrusions shall not exceed 10 mil per side.
Copyright ã ANPEC Electronics Corp.
27
www.anpec.com.tw
Rev. A.1 - Aug., 2007
ANPEC [ ANPEC ELECTRONICS COROPRATION ]
