AIR BoosterPack – User’s Manual
Page 33 of 45
Release Date 11/2/12
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J3 – External Device Interface
0.1” pitch thru-hole footprint which provides a single location for connecting external
devices (e.g. sensors) to the BoosterPack via SPI and/or I2C.
It is also possible to connect an external MCU acting as SPI/I2C master to this port,
provided the LaunchPad/BoosterPack MCU is removed or configured as SPI/I2C slave
device (e.g. to drive LEDs or monitor pushbuttons). Firmware examples for using the
LaunchPad/BoosterPack MCU as a slave device are not provided.
Please note that the shunt must be removed from JP2 when using an external SPI slave
device (see section for more details).
Table 19 – J3 External Device Connector Pinout
Pin
J3-1
Signal Name
I/O
-
Description
GND
Ground reference
J3-2 P1.4/CUR/MRDY/EXT_CS
O
O
Chip Select output to external SPI slave – active low
Supply voltage to external device(s)
MOSI output to external SPI slave
(MCU on LaunchPad or BoosterPack)
MOSI input from external SPI master
(external MCU connected via J3)
J3-3
VDD
O
I
J3-4
P1.7/MOSI
Clock output to external I2C slave(s)
(MCU on LaunchPad or BoosterPack)
Clock input from external I2C master
(external MCU connected via J3)
O
I
J3-5
SCL
MISO output to external SPI master
(external MCU connected via J3)
O
J3-6
J3-7
J3-8
J3-9
P1.6/MISO/LED2
SDA
MISO input from external SPI slave
(MCU on LaunchPad or BoosterPack)
I
I/O I2C Data
SCLK output to external SPI slave
O
(MCU on LaunchPad or BoosterPack)
SCLK input from external SPI master
(external MCU connected via J3)
Ground reference
P1.5/SCLK
GND
I
-
Not Used
O
(MCU on LaunchPad or BoosterPack)
Radio Module Chip Select input from external SPI
master
J3-10
P2.0/MODULE_SS
I
(external MCU connected via J3)
Radio Module Slave Ready output
Not Used
(MCU on LaunchPad or BoosterPack)
Radio Module hardware reset – active low
(external MCU connected via J3)
J3-11
J3-12
SRDY
MRST
O
O
I
ANAREN [ ANAREN MICROWAVE ]
