PRODUCT DATASHEET
AAT2601178
Total Power Solution for Portable Applications
Absolute Maximum Ratings1
TA = 25°C unless otherwise noted.
Symbol
Description
Value
Units
VIN
Input Voltage, CHGIN, BAT
Maximum Rating
Operating Junction Temperature Range
Storage Temperature Range
Maximum Soldering Temperature (at leads, 10 sec)
-0.3 to 6.5
VIN + 0.3
-40 to 85
-65 to 150
300
V
V
°C
°C
°C
Power and logic pins
TJ
TS
TLEAD
Recommended Operating Conditions2
Symbol
Description
Value
Units
θJA
PD
Thermal Resistance
Maximum Power Dissipation
25
4
°C/W
W
1. Stresses above those listed in Absolute Maximum Ratings may cause permanent damage to the device. Functional operation at conditions other than the operating conditions
specified is not implied. Only one Absolute Maximum rating should be applied at any one time.
2. Thermal Resistance was measured with the AAT2601 device on the 4-layer FR4 evaluation board in a thermal oven. The amount of power dissipation which will cause the
thermal shutdown to activate will depend on the ambient temperature and the PC board layout ability to dissipate the heat. See Figures 11-14.
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2601.2008.01.1.0
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