欢迎访问ic37.com |
会员登录 免费注册
发布采购

AAT1218IWP-1.2-T1 参数 Datasheet PDF下载

AAT1218IWP-1.2-T1图片预览
型号: AAT1218IWP-1.2-T1
PDF下载: 下载PDF文件 查看货源
内容描述: 1A , 1.2MHz的同步升压转换器 [1A, 1.2MHz Synchronous Boost Converter]
分类和应用: 转换器升压转换器
文件页数/大小: 15 页 / 1749 K
品牌: ANALOGICTECH [ ADVANCED ANALOGIC TECHNOLOGIES ]
 浏览型号AAT1218IWP-1.2-T1的Datasheet PDF文件第7页浏览型号AAT1218IWP-1.2-T1的Datasheet PDF文件第8页浏览型号AAT1218IWP-1.2-T1的Datasheet PDF文件第9页浏览型号AAT1218IWP-1.2-T1的Datasheet PDF文件第10页浏览型号AAT1218IWP-1.2-T1的Datasheet PDF文件第11页浏览型号AAT1218IWP-1.2-T1的Datasheet PDF文件第12页浏览型号AAT1218IWP-1.2-T1的Datasheet PDF文件第13页浏览型号AAT1218IWP-1.2-T1的Datasheet PDF文件第15页  
PRODUCT DATASHEET  
AAT1218  
TM  
SwitchReg  
1A, 1.2MHz Synchronous Boost Converter  
Ordering Information  
Description  
Package  
Marking1  
Part Number (Tape and Reel)2  
Adjustable Output Voltage  
Fixed 3.3V Output Voltage  
Fixed 5V Output Voltage  
Adjustable Output Voltage  
Fixed 3.3V Output Voltage  
Fixed 5V Output Voltage  
TSOPJW-12  
TSOPJW-12  
TSOPJW-12  
TDFN33-12  
TDFN33-12  
TDFN33-12  
2FXYY  
7JXYY  
7KXYY  
2EXYY  
5PXYY  
5RXYY  
AAT1218ITP-1.2-T1  
AAT1218ITP-3.3-T1  
AAT1218ITP-5.0-T1  
AAT1218IWP-1.2-T1  
AAT1218IWP-3.3-T1  
AAT1218IWP-5.0-T1  
All AnalogicTech products are offered in Pb-free packaging. The term “Pb-free” means semiconductor  
products that are in compliance with current RoHS standards, including the requirement that lead not exceed  
0.1% by weight in homogeneous materials. For more information, please visit our website at  
http://www.analogictech.com/about/quality.aspx.  
Package Information  
TDFN33-123  
Index Area  
Detail "A"  
0.43 0.05  
0.1 REF  
C0.3  
Pin 1 Indicator  
(optional)  
3.00 0.05  
1.70 0.05  
Top View  
Bottom View  
Detail "A"  
0.05 0.05  
Side View  
All dimensions in millimeters.  
1. XYY = assembly and date code.  
2. Sample stock is generally held on part numbers listed in BOLD.  
3. The leadless package family, which includes QFN, TQFN, DFN, TDFN and STDFN, has exposed copper (unplated) at the end of the lead terminals due to the manufacturing  
process. A solder fillet at the exposed copper edge cannot be guaranteed and is not required to ensure a proper bottom solder connection.  
w w w . a n a l o g i c t e c h . c o m  
14  
1218.2008.10.1.1