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AAT1145 参数 Datasheet PDF下载

AAT1145图片预览
型号: AAT1145
PDF下载: 下载PDF文件 查看货源
内容描述: 1.2A降压转换器 [1.2A Step-Down Converter]
分类和应用: 转换器
文件页数/大小: 16 页 / 305 K
品牌: ANALOGICTECH [ ADVANCED ANALOGIC TECHNOLOGIES ]
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PRODUCT DATASHEET  
AAT1145  
SwitchRegTM  
1.2A Step-Down Converter  
The input capacitor RMS ripple current varies with the  
input and output voltage and will always be less than or  
equal to half of the total DC load current.  
ripple) are equivalent series resistance (ESR), equivalent  
series inductance (ESL), and capacitance (C).  
The output voltage droop due to a load transient is  
dominated by the capacitance of the ceramic output  
capacitor. During a step increase in load current, the  
ceramic output capacitor alone supplies the load current  
until the loop responds. Within two switching cycles, the  
loop responds and the inductor current increases to  
match the load current demand. The relationship of the  
output voltage droop during the two switching cycles to  
the output capacitance can be estimated by:  
1
IRMS(MAX)  
=
· IO  
2
To minimize stray inductance, the capacitor should be  
placed as closely as possible to the IC. This keeps the  
high frequency content of the input current localized,  
minimizing EMI and input voltage ripple. The proper  
placement of the input capacitor (C1) can be seen in the  
evaluation board layout in Figures 3 and 4.  
2 · ΔILOAD  
=
COUT  
V
DROOP · fS  
A laboratory test set-up typically consists of two long  
wires running from the bench power supply to the eval-  
uation board input voltage pins. The inductance of these  
wires, along with the low-ESR ceramic input capacitor,  
can create a high Q network that may affect converter  
performance. This problem often becomes apparent in  
the form of excessive ringing in the output voltage dur-  
ing load transients. Errors in the loop phase and gain  
measurements can also result.  
In many practical designs, to get the required ESR, a  
capacitor with much more capacitance than is needed  
must be selected.  
For both continuous or discontinuous inductor current  
mode operation, the ESR of the COUT needed to limit the  
ripple to VO, V peak-to-peak is:  
Since the inductance of a short PCB trace feeding the  
input voltage is significantly lower than the power leads  
from the bench power supply, most applications do not  
exhibit this problem.  
ΔVO  
ESR ≤  
ΔIL  
Ripple current flowing through a capacitor’s ESR causes  
power dissipation in the capacitor. This power dissipation  
causes a temperature increase internal to the capacitor.  
Excessive temperature can seriously shorten the expect-  
ed life of a capacitor. Capacitors have ripple current rat-  
ings that are dependent on ambient temperature and  
should not be exceeded. The output capacitor ripple cur-  
rent is the inductor current, IL, minus the output current,  
IO. The RMS value of the ripple current flowing in the  
output capacitance (continuous inductor current mode  
operation) is given by:  
In applications where the input power source lead induc-  
tance cannot be reduced to a level that does not affect  
the converter performance, a high ESR tantalum or alu-  
minum electrolytic should be placed in parallel with the  
low ESR, ESL bypass ceramic. This dampens the high Q  
network and stabilizes the system.  
Output Capacitor Selection  
The function of output capacitance is to store energy to  
attempt to maintain a constant voltage. The energy is  
stored in the capacitor’s electric field due to the voltage  
applied.  
3
IRMS = ΔIL ·  
= ΔIL · 0.289  
6
The value of output capacitance is generally selected to  
limit output voltage ripple to the level required by the  
specification. Since the ripple current in the output induc-  
tor is usually determined by L, VOUT and VIN, the series  
impedance of the capacitor primarily determines the out-  
put voltage ripple. The three elements of the capacitor  
that contribute to its impedance (and output voltage  
ESL can be a problem by causing ringing in the low  
megahertz region but can be controlled by choosing low  
ESL capacitors, limiting lead length (PCB and capacitor),  
and replacing one large device with several smaller ones  
connected in parallel.  
w w w . a n a l o g i c t e c h . c o m  
1145.2007.11.1.1  
11